Ferroelectric Memory Gmbh

Rolf Jähne

Marko Noack

Johannes Ocker

Stefan Müller

In various embodiments, a memory cell arrangement is provided including a memory cell driver and one or more memory cells, wherein one or more control nodes of each of the one or more memory cells are electrically conductively connected to one or more output nodes of the memory cell driver. The memory cell driver may include: a first supply node to receive a first supply voltage and a second supply node to receive a second supply voltage, a plurality of input nodes to receive a plurality of input voltages, one or more output nodes, and a logic circuit connected to the first supply node, the second supply node, the plurality of input nodes, and the one or more output nodes, wherein the logic circuit includes one or more logic gates and is configured to connect via the one or more logic gates either the first supply node or the second supply node to the one or more output nodes in response to the plurality of input voltages.

Memory cell driver, memory cell arrangement, and methods thereof

A memory cell arrangement is provided that may include: a read-out circuit and a memory cell including: a first terminal, a second terminal, and a third terminal; the memory cell may be configured to control current flow between the second terminal and the first terminal as a function of a first voltage present at the first terminal, a third voltage applied at the third terminal, and a memory state of the memory cell. The read-out circuit is configured to: generate a characteristic voltage at the bitline by applying the third voltage at the third terminal and a second voltage at the second terminal, the characteristic voltage representing the memory state of the memory cell, and to determine the memory state of the memory cell based on sensing the characteristic voltage.

Memory cell arrangement and methods thereof

According to various embodiments, a memory cell may include: a field-effect transistor structure comprising a channel region and a gate structure disposed at the channel region, the gate structure comprising a gate electrode structure and a gate isolation structure disposed between the gate electrode structure and the channel region; and a memory structure comprising a first electrode structure, a second electrode structure, and at least one remanent-polarizable layer disposed between the first electrode structure and the second electrode structure; wherein the first electrode structure of the memory structure is electrically conductively connected to the gate electrode structure of the field-effect transistor structure.

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Ottendorf-Okrilla, Germany

Rolf Jähne