Siemens Aktiengesellschaft

Electrovac Gesmbh

Rolf Birkmann

Guenther Waitl

Hans-Ludwig Althaus

Axel Schubert

Werner Spaeth

Werner Kuhlmann

Waltraud Klos

Ewald Schmidt

A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap.

Hermetically tight glass-metal housing for semiconductor components and

An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.

Optoelectronic coupling element and method for its manufacture

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Laaber, Germany

Rolf Birkmann