Robert Boschgmbh

Rolf Becker

Klaus Voigtlaender

Thomas Wiesa

Ulrich Trescher

Thomas Raica

Willi Kuehn

Helmut Bubeck

Christian Lammers

Michael Krapp

Juergen Jerg

Ulrich Belzner

Jan Benzler

Johannes Duerr

Joachim Wolff

Volker Hochholzer

Wolf-Dieter Jonner

Kurt Weiblen

Jiri Marek

Chi-Thuan Cao

Helmut Baumann

Lutz Mueller

Frank Bantien

Ulrich Goebel

Gerhard Heess

Rolf-Hermann Mergenthaler

Wolfgang Jacob

Manfred W Meissner

Martin Willmann

Christoph Ruf

Uwe Wostradowski

Andreas Thomae

Antoine Chabaud

Albert-Andreas Hoebel

Reinhard Gutzeit

Ivica Durdevic

Andreas Fischer

Sven Lamers

Klaus Jaeckel

Juergen Schwaiger

Thomas Rupp

Philippe Jaeckle

Thorsten-Wilhelm Moeller

Thomas Michel

Bernd Gutohrlein

Bernd Lieberoth-Leden

J&uuml;rgen Schwaiger

Hendrik Ehrhardt

Joerg Breibach

Christopher Hahn

Reinhold Muench

Michael Schlecht

Fabian Bez

The invention relates to an electronic component () having a corrosion-protected bonding connection and a method for producing said component. For this purpose the electronic component () has at least one semiconductor chip () on a substrate (). Moreover, a bonding connection at risk of corrosion is provided on the semiconductor chip (). For encapsulation of the at least one semiconductor chip () and the at least one bonding connection at risk of corrosion, said semiconductor chip and bonding connection are surrounded by a hermetically sealing housing (). The hermetically sealed bonding connection is a bonding wire connection () which is fully enclosed in the housing (), in which the substrate () is at least partially enclosed. The substrate () has at least one surface-mounted hydrolysis-sensitive component () in the housing ().

Electronic component having a corrosion-protected bonding connection and method for producing the component

The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.

Control module for a transmission control installed in an automatic transmission

An electrical control unit has a printed circuit board substrate, on which an electronic circuit is situated, which circuit includes multiple electrical components which are interconnected via printed conductors of the printed circuit board substrate, as well as housing parts for covering the electrical components on the printed circuit board substrate, and at least one device plug connector part situated on the printed circuit board substrate outside the section of the printed circuit board substrate covered by the housing parts. Outside the section covered by the at least one housing part and outside the section of the printed circuit board substrate provided with the device plug connector part, at least one contact point for an additional electrical component is situated on the printed circuit board substrate.

Electric control unit having a housing part and a cooling part

A method and a device are for predicting a life expectancy of a product, which includes at least two components. The life expectancy is ascertained as a function of an assumed field loading of the product. The components of the product are acted upon by different loadings and are operated, in each instance, at the different loadings until they fail. An end-of-life curve of the component is recorded on the basis of the load-dependent failure times of a component. An EOL curve of the product is ascertained such that at the different loadings, it includes the EOL curve of the components which has, in each instance, the shortest failure time at the corresponding loading. The anticipated service life of the product is determined as a functional value of the EOL curve of the product as a function of the predefined loading of the product.

Method and device for predicting a life expectancy of a product containing a plurality of components

The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips () with essentially the same structure are mounted on a surface () pertaining to a first conductor carrier () and coated with strip conductors (). Said two semiconductor chips () comprise a first surface () and a second surface (), one semiconductor chip () being mounted on the conductor carrier surface () with the first surface () thereof, and the other semiconductor chip () being mounted on the conductor carrier surface () with the second surface () thereof. The second surface () of the first semiconductor chip () and the first surface () of the other semiconductor chip () are interconnected by a lead frame () with an A.C. power supply ().

Method for producing an electronic circuit

A method for increasing the manufacturing certainty of soldered connections between a ceramic carrier and a printed-circuit board. It includes the method step of applying a first decomposition-resistant metallization layer on a ceramic carrier and the subsequent imprinting onto the first metallizing layer of a second metallizing layer, improving the wetting performance. In this manner, it is possible to achieve an increase in the overall metallizing layer thickness in the edge area of a soldered connection, whose solder rise in turn makes possible an optical, fully-automatic monitoring of the soldered connection.

Method for improving the manufacturing safety of weld joints

In a method for producing a pressure sensor, a ceramic plate is joined to a shaped ceramic part. The shaped ceramic part has a depression. Around the depression there is provided a thick-layer paste which does not completely surround the depression. As a result, the air can escape from the depression during firing and a subatmospheric pressure can thus be enclosed in the depression.

Method for producing a pressure sensor

An ABS which evaluates slip values prescribes pressure values for the wheel brakes. In order to improve the driving stability, these pressure values are varied by a brake controller using the deviation of the yawing speed from a set value and the front-axle steering angle as input variables. The brake controller determines its output values (variation values) with the aid of the fuzzy logic. Additionally, rear-axle steering is integrated into the system, the system partially also using fuzzy logic. Subsequently, an adaptation which is based on fuzzy logic and uses the brake controller and the rear-axle steering controller in a weighted fashion is proposed.

System for controlling brake pressure based on fuzzy logic using

A method for electroconductively connecting two electronic circuits to one another. A contact is coated with a liquefied, electrically conductive, flux-free solder, and the coated contact is arranged over the other contact. Then, in the molten state, the electrically conductive solder is electroconductively connected to the other contact and hardened. In addition, a liquefied, hardenable, non-conducting bonding means is introduced between the two electronic circuits.

Method for electoconductively connecting contacts

Antilocking system

System for controlling yawing moment in a vehicle equipped with ABS and rear wheel steering includes a controller which generates a compensation steering angle for the rear wheels based on the difference between brake pressures at the front wheels. The difference is filtered so that the angle is zero up to a minimum pressure threshold and thereafter consists of a constant portion added to a variable portion which decreases with time. The compensation steering angle so generated may be modified by a correction factor dependent on the transverse acceleration of the vehicle and a further correction factor dependent on the velocity.

Vehicle with an antilock controller

A method is proposed for assembling micromechanical sensors, in particular Hall sensors, or pressure or acceleration sensors, in which at least one silicon sensor element is applied to a substrate. The at least one silicon sensor element is joined to the substrate via at least one assembly pedestal, the cap faces of which are kept small compared with the surface of the silicon sensor element, so that a gap exists between the substrate and the silicon sensor element except for the region of the at least one assembly pedestal.

Method of assembling micromechanical sensors

Antilock brake adjusting system

An anti-skid apparatus having a valve, which is embodied to form a pressure limiting device between the outlet of a return pump and a master brake cylinder. As a consequence, a high-pressure reservoir can be of smaller capacity and can therefore be less expensive, since the pressure limiting device protects the pressure reservoir and other hydraulic elements from a pressure overload.

Anti-skid apparatus for a vehicle brake system

Growing community of inventors

Pfullingen, Germany

Rolf Becker