Tec-Sem Ag

Rolf Bachmann

Jakob Blattner

Hans Schmid

A transfer device for wafers stacked in magazines has a vertically displaceable frame of a platform, with which the cover of the box surrounding the magazine in the closed condition. The magazine remains in the original position on the base of the box and is then supplied by a gripping device from this position to a processing system in which the wafers are removed from the magazine and are processed. A gripping device preferably has two extension arms arranged on both sides of the magazine as well as one stop element which can be caused to impact on the wafer edges. The stop element preferably has two lips consisting of an elastic material which lips can be caused to impact on the wafer edges. The device permits a very fast loading and unloading into or out of the processing system.

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Schoenenberg a.d. Thur, Switzerland

Rolf Bachmann