Growing community of inventors

Singapore, Singapore

Roland Yudadibrata Utama

Average Co-Inventor Count = 6.67

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 1

Roland Yudadibrata UtamaJohn Michael Cotte (2 patents)Roland Yudadibrata UtamaJeffrey Curtis Hedrick (2 patents)Roland Yudadibrata UtamaQiang Huang (2 patents)Roland Yudadibrata UtamaLaura Louise Kosbar (2 patents)Roland Yudadibrata UtamaRonald Dean Goldblatt (2 patents)Roland Yudadibrata UtamaBrett Caroline Baker-O'Neal (2 patents)Roland Yudadibrata UtamaSusan Huang (2 patents)Roland Yudadibrata UtamaShu-Yun Chong (2 patents)Roland Yudadibrata UtamaRob Steeman (2 patents)Roland Yudadibrata UtamaStuart Ross Wenham (1 patent)Roland Yudadibrata UtamaAlison Joan Lennon (1 patent)Roland Yudadibrata UtamaAnita Wing Yi Ho-Baillie (1 patent)Roland Yudadibrata UtamaRoland Yudadibrata Utama (3 patents)John Michael CotteJohn Michael Cotte (109 patents)Jeffrey Curtis HedrickJeffrey Curtis Hedrick (69 patents)Qiang HuangQiang Huang (42 patents)Laura Louise KosbarLaura Louise Kosbar (27 patents)Ronald Dean GoldblattRonald Dean Goldblatt (17 patents)Brett Caroline Baker-O'NealBrett Caroline Baker-O'Neal (9 patents)Susan HuangSusan Huang (4 patents)Shu-Yun ChongShu-Yun Chong (2 patents)Rob SteemanRob Steeman (2 patents)Stuart Ross WenhamStuart Ross Wenham (41 patents)Alison Joan LennonAlison Joan Lennon (9 patents)Anita Wing Yi Ho-BaillieAnita Wing Yi Ho-Baillie (3 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. International Business Machines Corporation (2 from 164,108 patents)

2. Newsouth Innovations Pty Limited (1 from 162 patents)


3 patents:

1. 10199516 - Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects

2. 9716192 - Method for fabricating a photovoltaic device by uniform plating on emitter-lined through-wafer vias and interconnects

3. 8398877 - Method of forming openings in selected material

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12/4/2025
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