Adv Antest Corporation

Roland Wolff

Eric Kushnick

Ben Rogel-Favila

Mei-Mei Su

James Fishman

A system for performing tests using automated test equipment (ATE) is disclosed. The system comprises a robot comprising an end effector operable to pick up and transfer a DUT in-and-out of a test slot in a primitive. The system further comprises a system controller comprising a memory and a processor for controlling the robot. Also, the system comprises a test rack comprising a plurality of primitives, wherein the primitive is a modular device comprising a plurality of slots for testing a plurality of DUTs, and wherein the robot is configured to access slots in the plurality of primitives within the test rack using the end effector.

Automated handling of different form factor devices under test in test cell

A scalable test platform can include one or more of a plurality of different device interface boards and a plurality of primitives. The different device interface boards can be configured to provide a uniform interface to couple different types of DUTs and or DUTs with different form factors to the plurality of primitives. The plurality of primitives can be configured to distribute power to the DUTs, and to perform system level testing of the respective DUTs. The plurality of primitives can be configurable by a user to perform any number of system level tests on a number of different types of DUTs and or DUTs with different form factors.

Scalable platform for system level testing

In one embodiment, a testing apparatus comprises: a modularized logic unit comprising circuitry for testing a plurality of devices under test (DUTs); a DUT interface board for physically and electrically interfacing with said modularized logic unit, said DUT interface board comprising: a loadboard comprising a plurality of sockets for receiving said plurality of DUTs; and a partial enclosure for partially enclosing said plurality of DUTs; a top fan disposed adjacent to a top of said partial enclosure; and a bottom fan disposed adjacent to a bottom of said partial enclosure, wherein the top fan and the bottom fan are operable to generate a vertical ambient air flow from the bottom fan to the top fan to cool said plurality of DUTs with exposed top and bottom sides, wherein the bottom fan is operable to draw ambient air from a surrounding environment.

Device testing using dual-fan cooling with ambient air

New cooling assembly suitable for use in the testing of devices is disclosed. The new cooling assembly transfers heat that is in close proximity to, within vicinity of, and/or in surrounding area adjacent to a DUT (device under test) undergoing testing to a target location that is away from the DUT. Consequently, the DUT is cooled. By employing heat pipes coupled to plates in contact with the DUT, the new cooling assembly augments cooling capacity at the DUT's location and surrounding area. Yet, the use of an ambient air flow generated by a fan is sufficient to manage and dissipate the heat transferred to the target location. Also, the new cooling assembly is readily installable in DUT testing equipment because its design is quite flexible to adapt to various requirements and space constraints of DUT testing equipment for different DUT footprints or form factors.

Device testing with heat pipe cooling assembly

In an embodiment, a universal test cell includes a plurality of test slots configured to receive a plurality of universal test containers each including similar dimensions. Each universal test container is configured to enclose each of a plurality of different devices to test. Each universal test container includes an external electrical interface configured to couple to each of the plurality of different devices to test. The universal test cell is configured to test the plurality of different devices while each is located within a universal test container of the plurality of universal test containers. The universal test cell includes a plurality of universal electrical interfaces that are each configured to couple with the external electrical interface of each universal test container.

Universal test cell

In one embodiment, a universal test container can include a universal external electrical interface configured to couple to each of a plurality of different devices to test. In addition, the universal test container is configured to enclose each of the plurality of different devices to test.

Universal container for device under test

In an embodiment, a universal test floor system includes a first robot that is configured to pack a plurality of universal test containers each including similar dimensions into a universal bin. Each universal test container is configured to enclose each of a plurality of different devices to test. The universal test floor system includes a universal conveyor configured to transport the universal bin. The first robot is configured to put the universal bin onto the universal conveyor and a second robot is configured to remove it. A universal test cell system is configured to receive the universal bin. The universal test cell system includes a plurality of test slots configured to receive a plurality of universal test containers. The universal test cell system is configured to test the plurality of different devices while each is located within one of the plurality of universal test containers.

Universal test floor system

A tester system is disclosed. The tester system comprises a tester module operable to generate test signals for testing a plurality of DUTs. It also comprises a plurality of cables operable to communicatively couple the tester module with a tray comprising the plurality of DUTs through a thermal chamber wall interface. Further, it comprises a plurality of connectors in contact with the tray, wherein the plurality of connectors is operable to provide an interface between the plurality of cables and conductive traces on the tray, and further wherein each of the plurality of connectors is operable to pass a respective subset of the test signals to each DUT on the tray via the conductive traces.

Growing community of inventors

Santa Rosa, CA, United States of America

Roland Wolff