Infineon Technologies Ag

Roland Wenzel

Klaus Goller

An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.

Interconnections for integrated circuits

A test structure can be used to determine the electrical loadability of contacts. This structure includes a first interconnect line and a second interconnect line arranged above the first interconnect line. A via electrically couples the first interconnect line to the second interconnect line. A plurality of additional conductive structures are arranged in a closely adjacent manner around the via. These additional structures lie in the same plane as either the first interconnect line or the second interconnect line.

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Maulbronn, Germany

Roland Wenzel