Hueck Folien Gesellschaft M.b.h.

Ems-patent Ag

W.e.t. Automotive Systems Ag

Hueck Folien Ges.m.b.h.

Roland Treutlein

Martin Bergsmann

Friedrich Kastner

Johann Hillburger

Ronald Einsiedler

Günter Schmid

Marcus Halik

Wolfgang Clemens

Henning Rost

Adolf Bernds

Ulrich Presenz

Mark Pfleghar

Heinz Caviezel

Matthias Müller

Axel Gerlt

Gerhard Zaschke

Werner Geitner

Thomas Kesmarszky

Disclosed is an impact-resistant modified polyamide molding compound which is suitable in particular for the production of containers having a good oxygen barrier and low-temperature impact strength. Also disclosed are containers which are produced from the thermoplastic polyamide molding compound. In particular, storage or transport containers for industrial chemicals, agrochemicals, the cosmetic industry, pharmaceutical industry or foodstuffs industry can be produced from the polyamide molding compound of the invention.

Impact-resistant modified polyamide moulding compound and container formed therefrom

A device for the storage of at least one of solid, liquid or gaseous objects. The device including at least one compartment that is configured to contain at least one object. The filling or emptying of the compartment triggers an electrically-readable signal. In one embodiment, the compartment may be mechanically modified and an electrically-readable signal is generated based on a corresponding mechanical change to the compartment. An electrical data memory with at least one memory cell is integrated into the device. The memory cell is assigned to the compartment. The memory cell is configured to adopt a value corresponding to the mechanical change to the compartment. The device also includes an analytical circuit for reading the data memory.

Device for the storage of solid and/or liquid and/or gaseous objects

A vapor-deposited metallized film is disclosed including a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times and also a method for producing a vapor-deposited metallized film, a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times, wherein either a structure is printed onto a substrate or onto a supporting film with a soluble ink or the base materials are directly cleaned in a vacuum by means of plasma processing and are simultaneously initiated with target atoms, and wherein a metal or the like is vapor-deposited thereon followed by a production of the structured layer, for multiple uses, for example, in securities, as a radio frequency antenna for transponders and the like.

Metallized film, method for the production thereof, and use thereof

A partially vapor-deposited metallized film is disclosed including a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times and also a method for producing a partially vapor-deposited metallized film, a metallized film that is vapor-deposited across the entire surface, and a metallized film that has been coated a number of times, wherein either a structure is printed onto a substrate or onto a supporting film with a soluble ink (washable ink) or the base materials are directly cleaned in a vacuum by means of plasma processing and are simultaneously initiated with target atoms, and wherein a metal or the like is vapor-deposited thereon followed by a production of the structured layer, for multiple uses, for example, in securities, as a radio frequency antenna for transponders and the like.

The invention relates to a halogen-free composite film including at least three to N sealable, multi-layered composite film(s), wherein N is an integer from 4 to 10, and in which a functional layer and/or a functional element is interposed between the individual composite films, in addition, the invention relates to a method for manufacturing the halogen-free composite film and its use as a flexible, multi-purpose material.

Film composite, method for producing the same and its use

Growing community of inventors

Pirk, Germany

Roland Treutlein