Jt International S.a.

Unaxis International Trading Ltd

Esec, Trading Sa

Roland Stalder

Andrew Robert John Rogan

Jonathan Medding

Daniel Schnetzler

Martina Lustenberger

Marcel Niederhauser

Daniel Wilhelm

A heating system is provided for an inhaler device, such as an e-cigarette or a personal vaporizer device, for generating an aerosol or a vapour from a liquid to be heated. The system comprises: at least one supply channel for conveying a liquid to be heated from a supply reservoir under capillary action or surface tension forces within the at least one channel; and heating means arranged at an outlet of the at least one supply channel and configured to heat the substance as it emerges from the outlet of the at least one channel. The heating means preferably comprises at least one heating element which extends across a width or an outlet opening of the supply channel and is typically confined to the outlet of the supply channel.

Heating system and method for an inhaler device

An aerosol generating device includes a target; a laser emitter configured to emit light and vaporise a vaporisable material at the target in use; and an optional light guide for guiding light emitted from the laser emitter to the target. An aerosol generating system includes the aerosol generating device and an outer shell for receiving the aerosol generating device in use.

Aerosol generating device with a laser

There is provided an aerosol generating device (), the device comprising: a target (); a laser emitter () configured to emit light and vaporise a vaporisable material at the target in use; and an optional light guide () for guiding light emitted from the laser emitter to the target. There is also provided an aerosol generating system comprising the aerosol generating device and further comprising an outer shell (A,B) for receiving the aerosol generating device in use.

The detachment of a semiconductor chip () from a foil () and picking the semiconductor chip () from the foil () takes place with the support of a chip ejector (), that has a ramp (), the surface () of which is formed concave and ends at a stripping edge () projecting from the surface () of the chip ejector (), and a support area () with grooves () arranged next to the stripping edge (). Vacuum can be applied to the grooves (). The detachment and picking of the semiconductor chip () from the foil () takes place in that the wafer table () is shifted relative to the chip ejector () in order to pull the foil () over the stripping edge () protruding from the surface () of the chip ejector (), whereby the semiconductor chip () temporarily detaches itself at least partially from the foil () and lands on the foil () above the support area (), and in that the chip gripper () picks the semiconductor chip () presented on the support area ().

Method for detaching a semiconductor chip from a foil and device for mounting semiconductor chips

An apparatus for mounting semiconductor chips on a substrate with which the semiconductor chips are presented on a foil clamped in a frame at a first location A comprises a chip gripper for the transport of the semiconductor chip presented at the first location A to a second location located on the substrate, a movable table for accepting the frame, a chip ejector arranged underneath the foil at the first location A the upper surface of which facing towards the foil has holes connected to a vacuum source, as well as a measuring camera directed at the first location A for establishing the position of the presented semiconductor chip. Correction of a possible position deviation of the presented semiconductor chip from its set position takes place in accordance with the invention in that the foil is secured by the chip ejector by means of vacuum and then at least the upper surface of the chip ejector facing towards the foil is moved in the plane running parallel to the under side of the foil.

Growing community of inventors

Zurich, Switzerland

Roland Stalder