Mosaid Technologies Corporation

Conversant Intellectual Property Management Incorporated

Novachips Canada Inc.

Roland Schuetz

Jin-Ki Kim

Peter B Gillingham

Hong Beom Pyeon

HakJune Oh

Steven Przybylski

Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die's native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface.

Reconfiguring through silicon vias in stacked multi-die packages

A memory system has a controller. A plurality of memory devices are serially interconnected with the controller via an n-bit data interface. The memory system is configurable in a first mode to communicate each read and write operation between the controller and the memory devices using all n bits of the data interface. The memory system is configurable in a second mode to concurrently: communicate data associated with a first operation between the controller and a first target memory device using only m bits of the data interface, where m is less than n; and communicate data associated with a second operation between the controller and a second target memory device using the remaining n-m bits of the data interface. A memory device, a memory controller, and a method are also described.

Serially connected memory having subdivided data interface

A system having serially connected memory devices in a ring topology organization to realize high speed performance. The memory devices have dynamically configurable data widths such that the system can operate with up to a maximum common number of active data pads to maximize performance, or to operate with a single active data pad to minimize power consumption. Therefore the system can include a mix of memory devices having different data widths. The memory devices are dynamically configurable through the issuance of a single command propagated serially through all the memory devices from the memory controller in a broadcast operation. Robust operation of the system is ensured by implementing a data output inhibit algorithm, which prevents valid data from being provided to the memory controller when read output control signal is received out of its proper sequence.

System having one or more memory devices

A configurable memory subsystem includes a memory module with a circuit board having a first and a second memory-containing device (MCD) pair mounted thereto. Each MCD pair has a first MCD in communication with a second MCD. Each MCD has an input port, an output port, and a memory each communicating with a bridge. In response to a command, the bridge transfers at least one of a portion of a data packet from the input port to the output port or to the memory, or transfers a portion of a memory packet from the memory to the output port. A loop-back device receives the command and the data packet form the first MCD pair and transmits the command and data packet to the second MCD pair.

Configurable module and memory subsystem

An arrangement of memory devices and a controller is based on an interface with a reduced pin count relative to a known memory device and controller arrangement. Facilitating the reduced pin count interface the reduction of multiple strobe signal to a single strobe signal. In addition, a packet header transmitted on the data bus followed by a payload, includes an encoded indication of the type of the payload. Aspects of the present application relate to providing a traditional memory device with external logic devices, where the logic devices handle the single strobe and the packet header, thereby permitting single strobe operation.

Single-strobe operation of memory devices

A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.

Multi-chip package with pillar connection

A semiconductor device includes a substrate having a plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice are stacked on the bonding surface of the substrate to form a die stack. Each die has a plurality of die bonding pads arranged along at least one bonding edge thereof. The remaining edges of each die are non-bonding edges. A plurality of bonding wires each electrically connects one of the die bonding pads to one of the substrate bonding pads. At least one thermally conductive layer is disposed between two adjacent semiconductor dice. At least one thermally conductive lateral portion is in thermal contact with the at least one layer of thermally conductive material. Each thermally conductive lateral portion is arranged along a non-bonding edge of the die stack.

Multi-chip package with thermal frame and method of assembling

A method of identifying at least one anomalous device in a configuration of series-connected semiconductor devices, comprising: selecting a device in the configuration; sending a command to the selected device, the command for placing the selected device into a recovery mode of operation; attempting to elicit identification data from the selected device while in the recovery mode of operation; if the attempt is successful, selecting a next device in the configuration of series-connected semiconductor devices and repeating the sending and the attempting to elicit; and if the attempt is unsuccessful, concluding that the selected device is an anomalous device. Also, a method of recovering data from a configuration of series-connected semiconductor memory devices having undergone a failure, comprising: placing an operable device of the configuration into a recovery mode of operation; while the operable device is in the recovery mode of operation, retrieving data currently stored by the operable device; and storing the retrieved data in an alternate memory facility.

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Ottawa, Canada

Roland Schuetz