Siemens Aktiengesellschaft

Roland Rubner

Hellmut Ahne

Eberhard Kuhn

Wolfgang Kleeberg

Hans Kruger

Siegfried Birkle

Erwin Schmidt

Wieland Bartel

Wolfgang Rogler

Hubert Aulich

Wolfgang Von Gentzkow

Johann Kammermaier

Friedrich Weidinger

Hans Hauschildt

Eva-Maria Rissel

Hartwig Bierhenke

Wolfgang V Gentzkow

An electrophotographic recording material is applied on a plate-shaped or drum-shaped substrate in a layer structure of superposed layers which comprises a photoconductive layer and at least the uppermost layer is fashioned of amorphous, hydrogen-containing carbon. The amorphous, hydrogen-containing carbon layer is deposited from a radio frequency excited low-pressure plasma with gaseous hydrocarbon as a reaction gas and in which a self-bias DC voltage is superimposed on the radio frequency field. The a-c:H material obtained in this manner is semiconducting and has photoconductive properties so that it can be employed for the photoconductive layer of the electrophotographic recording material.

Electrophotographic recording material and method for the manufacture

The invention relates to a method for the production of orientation layers for liquid crystal displays by applying a solution of an organic prepolymer to a transparent substrate and subsequently annealing the layer and subjecting it to an orientation treatment, wherein prepolymers of polyoxazoles, polythiazoles, polyimidazoles, polyoxazinones, polyoxazine diones or polyquinoxalines are used as the organic prepolymer. The method is particularly suitable for the preparation of orientation layers for glass-solder liquid crystal displays.

Method for producing orientation layers for liquid crystal displays and

The invention relates to a method for the preparation of thin polyimide layers by applying a solution of a polyimide prepolymer to a substrate, and subsequently annealing, and has as its object the provision of a method of this type in such a way that the preparation of layers with layer thicknesses of .ltoreq.0.2 .mu.m is made possible which layers have a homogeneous character and exhibit good adhesion. For this purpose, the invention provides that film-forming prepolymers of highly heat-resistant polyimides are used which prepolymers give off a high percentage of volatile products in annealing. The method according to the invention is particularly suitable for the production of orientation layers for liquid-crystal displays.

Method for the preparation of thin polyimide film

The invention relates to a method for the preparation of orientation layers for liquid crystal displays wherein a solution of an organic prepolymer is applied to a transparent substrate, and the prepolymer is then annealed to result in the desired polymer, which is then subjected to an orientation treatment, and has the objective to develop a method of this type in such a manner that it is possible to prepare orientation layers which can be highly stressed thermally and are dimensionally stable, i.e., are not subject to changes of morphological structure even at temperatures of .gtoreq.420.degree. C. For this purpose, the invention employs prepolymers of polyquinazoline diones or polyisoindoloquinazoline diones. The method according to the invention is suited in particular for the preparation of orientation layers for glass solder, liquid crystal displays.

Method for the preparation of orientation layers for liquid crystal

Liquid crystal display with a liquid crystal layer which can be switched between two optically different states. Two support plates have the surfaces facing each other coated with an electrically conducting layer as well as an orientation layer with at least one orientation layer consisting of a polymer. The plates enclose the liquid-crystal layer. The polymer is liquid-crystalline and can be switched to the off-state and on-state--in the process of which it generates the rest state of the liquid-crystal layer in the off-condition and, in the on-condition, at least enhances the excited state of the liquid-crystal layer.

Liquid-crystal display having orienting polymer with flexible bridges

The invention relates to the use of N,N'-bis-salicyloyl hydrazine as a metal deactivator for organic materials which are in contact with copper or contain copper or copper ions, and has the object of providing an N,N'-bis-salicyloyl hydrazine which allows processing without danger on an industrial scale. For this purpose, the invention provides an N,N'-bis-salicyloyl hydrazine which is prepared from salicylic-acid alkyl ester and either hydrazine or salicylic-acid hydrazide. N,N'-bis-salicyloyl hydrazine prepared in this manner serves particularly as a metal deactivator in cable and wire insulation for power and communications engineering.

N,N'-Bis-salicyloyl-hydrazine as a metal deactivator

Relief structures comprised of double lacquer layers on substrates already having relief structures for integrated semiconductor circuits are produced by applying a lower lacquer layer onto such substrate and which is composed of a material which does not cross-link or decompose due to radiation energy and which has only relatively slight sensitivity at the radiation energy dosage range utilized for structuring; applying an upper lacquer layer onto the lower lacquer layer and which upper layer is thinner relative to the thickness of the lower layer by a factor of at least 2 and is composed of a highly sensitive negative lacquer material; generating desired relief structures in the upper lacquer layer and removing those portions of the lower lacquer which are not covered by the upper negative lacquer layer.

Method of producing relief structures for integrated semiconductor

The present invention relates to oligomeric and/or polymeric precursor stages of polyimidazoles and polyimidazopyrrolones, as well as to a method for preparing these new precursor stages. The invention provides addition products of olefinically unsaturated monoepoxides on amino group-containing polycondensation products of aromatic and/or heterocyclic tetraamino compounds with dicarboxylic-acid chlorides or esters or on amino group-containing polyaddition products of the tetraamino compounds and tetracarboxylic-acid dianhydrides. The radiation-reactive precursor stages according to the invention are suited, for example, for the preparation of highly heat-resistant relief structures.

Polyimidazole and polyimidazopyrrolone precursor stages and the

The invention relates to oligomeric and/or polymeric precursor stages of polyoxazoles, as well as to a method for the preparation of these precursor stages. New radiation-reactive polymer precursor stages are provided comprised of addition products of olefinically unsaturated monoepoxides on hydroxyl group-containing polycondensation products of aromatic and/or heterocyclic dihydroxy diamino compounds with dicarboxylic-acid chlorides or esters. The radiation-reactive precursor stages according to the invention are suitable, for example, for the preparation of highly heat-resistant relief structures and as coatings for the optical fibers of light waveguides.

Polyoxazole precursor and the preparation thereof

The invention relates to a method for the manufacture of positive resist structures by means of short-wave UV rays and has the objective to develop such a method in a manner such that increased sensitivity and resolution as well as high thermal stability and, in addition, transparency in the wave-length range above 260 nm can be achieved. According to the invention, it is provided for this purpose to use as the resist material copolymers of 1 to 70 mol % alkylmethacrylate with an alkyl radical having 1 to 4 C atoms, and 99 to 30 mol % of an ethylenically unsaturated monomer with chlorine and/or cyan substituents. The method according to the invention is particularly well suited for producing resist structures about 0.5 to 2 .mu.m thick by means of UV rays in the wave-length range between about 180 to 260 nm.

Method for the manufacture of resist structures

The invention relates to heat-resistant positive resists based upon precursor stages of highly heat-resistant polymers and light-sensitive diazoquinones, as well as to a method for preparing heat-resistant relief structures of such positive resists. The positive resists of the type mentioned are developed in such a manner that they are heat-resistant as well as have a long storage life and are easily processed. The invention provides for the use of oligomer and/or polymer precursor stages of polyoxazoles in the form of polycondensation products of aromatic and/or heterocyclic dihydroxydiamino compounds and dicarboxylic acid chlorides or esters. The positive resists according to the invention are suitable especially for applications in microelectronics.

Method for the preparation of heat-resistant relief structures using

The present invention relates to oligomeric and/or polymeric radiation-reactive precursor stages of polyimides, polyisoindoloquinazoline diones, polyoxazine diones and polyquinazoline diones as well as to a method for the preparation of these radiation-reactive precursor stages. The invention provides addition products of olefinically unsaturated monoepoxides on carboxyl group-containing polyaddition products of aromatic and/or heterocyclic tetracarboxylic-acid dianhydrides and diamino compounds or diamino compounds with at least one ortho-position amido group, or on carboxyl group-containing polyaddition products of aromatic and/or heterocyclic dihdyroxy dicarboxylic acids or corresponding diaminodicarboxylic acids and diisocyanates. The radiation-reactive precursor stages according to the invention are suitable, for example, for the manufacture of highly heat-resistant relief structures.

Polyimide, polyisoindoloquinazoline dione, polyoxazine dione and

The invention relates to oligomeric and/or polymeric radiation-reactive precursor stages of polymers on the basis of heterocycles and has the objective to make available radiation-reactive precursor stages of this kind in which the problems arising due to the need of using organic solvents are eliminated. For this purpose, the invention provides addition products of cyclic carboxylic-acid anhydrides with hydroxyl group-containing compounds, where the hydroxyl group-containing compounds represent addition products of olefinically unsaturated monoepoxides on carboxyl group-containing prepolymers of polyimides, polyisoindoloquinazoline diones, polyoxazine diones and polyquinazoline diones or on amino group-containing prepolymers of polyimidazoles and polyimidazopyrrolones or on hydroxyl group-containing prepolymers of polyoxazoles. The radiation-reactive precursor stages according to the invention are suited, for example, for the manufacture of highly heat-resistant relief structues.

Radiation-reactive precursor stages of highly heat-resistant polymers

The invention relates to a method for the preparation of highly heat-resistant relief structures with a base of polymers of heterocyclic structure by applying radiation-sensitive soluble polymer precursor stages in the form of a film or foil to a substrate, irradiating the film or foil through negative patterns with actinic light or by deflecting a light, electron or ion beam, removing the non-irradiated film or foil portions and, optionally, by subsequent annealing, as well as to the use of relief structures prepared in this manner. It is provided to use as polymer precursor stages addition products of cyclic carboxylic-acid anhydrides with hydroxyl group-containing compounds, where the hydroxyl group-containing compounds represent addition products of olefinically unsaturated mono-epoxides on carboxyl group-containing prepolymers of polyimides, polyisoindoloquinazoline diones, polyoxazine diones and polyquinazoline diones or on amino group-containing prepolymers of polyimidazoles and polyimidazopyrrolones or on hydroxyl group-containing prepolymers of polyoxazoles. The relief structures prepared by the method according to the invention are suitable especially for use as resists, surface coating materials and insulating materials.

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Rottenbach, Germany

Roland Rubner