Basf Aktiengesellschaft

Basf Lacke+farben Ag

Roland Peter

Philipp Eisenbarth

Jan Holoch

Anton Hesse

Thomas Folda

Thomas Allspach

Klaus Ebel

Lothar Schlemmer

Bernhard Czauderna

Dietmar Nissen

Klaus Wilhelm Lienert

Gerd Linden

Gerold Schmidt

Juergen Nieberle

Volker Altstaedt

Michael Schink

Wire coatings and processes for their preparation

Solid, fusible bismaleimide resins formed from a mixture of a bismaleimide and an aminophenol still contain from 70 to 90 mol % of unconverted bismaleimide and from 30 to 60 mol % of unconverted aminophenol.

Bismaleimide resin containing unreacted monomer reactants

Heat-curable resins which are suitable for fabricating carbon fiber prepregs and fiber composites by winding and resin transfer molding contain a bismaleimide, an alkenylphenol and N-vinylpyrrolidone.

Heat-curable bismaleidmide/alkenyl phenol/N-vinyl pyrrolidone resin

Heat-curable bismaleimide resins containing an aromatic alkenyl compound, preferably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated temperatures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.

Heat-curable bismaleimide resins

A thickened, uncrosslinked molding composition which has a long shelf life and can be cured above 50.degree. C. comprises a liquid reactive system, a thickener, a polymerization initiator and conventional additives. The thickener is a combination of a primary aromatic amine and an isocyanate. The molding compositions, which are, in particular, SMCs or BMCs, can be processed into moldings by compression molding, injection molding or transfer molding and subsequent curing.

Thickened molding compositions

Heat-curable bismaleimide resins contain a bismaleimide and a heterocyclic comonomer having terminal alkenyl or alkenyloxy groups. A preferred comonomer is 2,6-bis-(2-propenylphenoxy)-pyridine. The bismaleimide resins are suitable for the production of high performance composites.

Heat-curable bismaleimide-alkenyl heterocyclic molding material

Vinyl ester resins possess unsaturated terminal groups and are based on polyphenols of the formula

Vinyl ester resins

Novel phenol compounds of the general formula ##STR1## where X is a sulfone group or contains a sulfone group, are suitable for the preparation of epoxy resins, vinyl ester resins, bismaleimide resins and cyanate resins.

Novel polyphenol and thermosetting plastics prepared therefrom

Epoxy resins obtained from an epoxyalkyl halide and an aromatic hydroxyl-containing melamine derivative, and vinyl ester resins based on a reaction product of the epoxy resin with an unsaturated monocarboxylic acid can be cured to give molded materials having high heat distortion resistance.

Epoxy resins obtained from reaction of epoxyalkyl halides and aromatic

Bismaleimides having the general formula ##STR1## in which n is a whole number between 5 and 70 and --X-- is --O-- or --NH-- are prepared through the reaction of the corresponding amino-terminated polyoxybutylenes with 2 moles of maleic anhydride. They are suited as toughening agents in high grade reactive resins.

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Roland Peter