Ceramtec Gmbh

Hoechst Ceramtec Aktiengesellschaft

Roland Leneis

Alexander Dohn

Klaus Herrmann

Alfred Thimm

Roland Dilsch

Dietmar Jähnig

Kurt Hugl

Matthias Eschle

To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Multi-layer cooling element

A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

Metal coating on ceramic substrates

Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with Nwhile controlling oxygen at 0-50 ppm O, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with Nwhile keeping the oxygen content at 0-50 ppm O.

Circuit board made of AIN with copper structures

A process for producing a plate from a brittle material Which can be individually separated by breaking to form one or more smaller platelets. In this process, laser scoring is used to produce in a single plate of large dimensions

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Marktredwitz, Germany

Roland Leneis