International Business Machines Corporation

Roland Joseph Braun

Gary R Carden

Keith A Snyder

William Ditlef Von Voss

In a field-accessed magnetic domain device package assembly, the magnetic domain device carrier or support, the circuit line or conductor carrier, and the magnetic bias field source are integrally and coactively provided by a common substrate member. The member is a planar permanent magnetic insulator ceramic and carries a bonded conductor or wiring pattern. The input/output (I/O) terminals of the domain device, also referred to in the art as a chip, are selectively bonded to the conductors of the pattern thereby providing mechanical support of the chip directly to the substrate in a superimposed relationship, input/output electrical connection to the chip, and mounting of the chip in close proximity to the bias field source, the flux of which passes through the superimposed mounted chips to a high permeability member at least part of which is disposed on the opposite side of the chip.

Substrate for magnetic domain device

Field accessed magnetic domain device apparatus, of the kind which employs an inner and an encompassing outer solenoid as the rotational magnetic field orthogonal drive coil members with the magnetic domain device(s) mounted within the inner solenoid, has conductive shield means disposed within the inner solenoid between the device(s) and the solenoids. This results in a substantially uniform flux distribution which passes through the inner solenoid and/or mitigation of the adverse effects of the stray flux between turns of the solenoids. As a consequence, a substantially uniform rotational magnetic field distribution is provided in the active area for the device(s), generally referred to as magnetic bubble device(s) or chip(s).

Magnetic domain device shield

For a bubble memory package, the two conductors operative to generate the rotational magnetic field consist of two thin, solid disks with a number of current contact points around their respective peripheries. Then, by selectively advancing the current injection/extraction points around the periphery, the current through the disks and thus the associated magnetic field can be rotated over a full 360.degree. thereby generating the rotational magnetic field required to effect the domain propagation necessary to the operation and function of a bubble memory device.

Rotational field generator for bubble memory package

Surface connections of electrical component leads to circuit substrate lands are made with split sleeves on the lead ends, adjusted for contact with the lands, and soldered in position to join leads, sleeves, and lands.

Electrical connection structure and method

Dual, slotted reflection plates for a bubble memory package use electrically and thermally conductive plates spaced just far enough apart to accept one or two levels of bubble memory devices between them. Each plate has a plurality of slots therein, each matching the appropriate portions of the coil generating the magnetic field for the bubble memory package.

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Vestal, NY, United States of America

Roland Joseph Braun