Infineon Technologies Ag

Siemens Aktiengesellschaft

Roland Gessner

Horst Baumeister

Gundolf Wenger

Eberhard Veuhoff

Manfred Druminski

Bernd Borchert

Margit Beschorner

The invention relates to a method for fabricating a structure in a semiconductor material. At least one etching step is carried out in-situ in an epitaxy installation and tertiary butyl chloride is used as the etchant. The at least one etching step produces at least one grating structure of a DFB laser. This provides an efficient method for fabricating DFB lasers.

Method for the in-situ fabrication of DFB lasers

A method produces structures for semiconductor components, particularly BH laser diodes, in which a mask material is applied to a sample in a masking step. The etch rate in an etching step depends upon the composition and/or nature of the mask material. The etch rate is selected in such a way so that the mask is at least partly dissolved during the etching step. It is therefore possible to easily remove the mask from the semiconductor material and apply additional layers in situ during the fabrication of semiconductor components.

Masking method for producing semiconductor components, particularly a BH laser diode

Method of producing a structure for III-V semiconductor components in which a mask is applied to a sample in a masking step, characterized in that at least one mask material is a monocrystalline III-V semiconductor material. This makes possible an easy in-situ removal of the mask from the semiconductor material, which in turn makes possible the growing of additional layers.

In-situ mask technique for producing III-V semiconductor components

A semiconductor laser on an InP substrate having a first confinement layer and a second confinement layer of (Ga.sub.0.17 Al.sub.0.83).sub.0.48 In.sub.0.52 As and an active layer in quantum well structure having radiation-generating QW-layers of Ga.sub.1-y In.sub.y As.

Semiconductor laser in the system GaAlInAs

The invention relates to a method for the production of extremely flat silicon troughs in a silicon substrate for MOS-transistors. The object is generally achieved by a localized etching process resulting in a slightly anisotropic trough characteristic and a subsequent rate controlled filling by a selection epitaxy process of said trough with a silicon material. The process is found to minimize the deleterious non-uniformities inherent in the prior art.

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Geretsried, Germany

Roland Gessner