At&t Bell Laboratories

At&t Technologies, Inc.

Roland Ellis, Jr

Edward J March

Bryan C Chung

Raymond J Newman

Brian E Jacobs

Kenneth G Frazee

A reagent chemical is directed along a first pipe portion (20) that extends along one side of the array of wafers (14) and which contains a plurality of jets (33) for projecting the chemical toward the wafers. A plurality of second pipe portions (21) transmits an inert gas, with each pipe portion having a plurality of jets (34) for projecting the gas toward the floor of the tank.

Semiconductor wafer cleaning method and apparatus

A template (148), having at least one opening (152) therein, is placed in close, spaced, relation to a PCB (30). The opening (152) is circular with a small semicircular notch (154) on the periphery thereof. A chip carrier (10) is positioned in the opening (152) with one corner (22) loosely captured in the notch (154). The PCB (30), template (148) and the loosely captured chip carriers (10) are placed in a condensation soldering facility to reflow the solder. As the solder reflows the chip carrier (10) rotates slightly about the loosely captured corner (22) to self align pads (33) on the PCB (30) to leads (16) on the chip carrier (10) as the bond is being formed.

Technique for bonding a chip carrier to a metallized substrate

Growing community of inventors

Burlington Township, NJ, United States of America

Roland Ellis, Jr