Ceramtec Gmbh

Roland Dilsch

Alfred Thimm

Alexander Dohn

Roland Leneis

Sigurd Adler

Harald Kress

A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or AlO. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.

Method for producing multi-level metalization on a ceramic substrate

To provide more space for additional circuit elements (coils, capacitors) and/or to allow the accommodation of additional circuit elements required for shielding the circuits, the metallization regions are arranged one over the other in at least two metallization layers. The carrier body has a surface on which sintered metallization regions are arranged in a first metallization layer, said metallization regions carrying electronic components and/or being structured such that the metallization regions form resistors or coils. The metallization regions are covered, together with the components and/or the resistors or coils, by a ceramic plate, and optionally additional metallization regions are arranged in additional metallization layers on the ceramic plate and each metallization region is covered by a ceramic plate. Sintered metallization regions are arranged in a metallization layer for the purpose of accommodating circuit elements on the uppermost ceramic plate facing away from the cooling elements.

Growing community of inventors

Thierstein, Germany

Roland Dilsch