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Siltronic Ag

Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Wacker Siltronic Gesellschaft F&uuml;r Halbleiter Materialien Ag

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien

Roland Brunner

Hans-Joachim Luthe

Franz Sollinger

Susanne Bauer-Mayer

Georg-Friedrich Hohl

Rudolf Griesshammer

Anton Schnegg

Helmut Kirschner

Helmut Schwenk

Georg Hochgesang

Johann Zach

Gertraud Thalhammer

G&uuml;nther Brunner

Ludwig Lamprecht

Bertram MÖCKEL

Simon Rothenaicher

Jonny Franke

A process for the wet chemical treatment of semiconductor wafers, in which the semiconductor wafers are treated with treatment liquids, has the semiconductor wafers firstly treated with an aqueous HF solution, then treated with an aqueous Osolution and finally treated with water or an aqueous HCl solution, these treatments forming a treatment sequence.

Process for the wet chemical treatment of semiconductor wafers

A centrifuge for a semiconductor wafer has a centrifuge plate for holding a semiconductor wafer, has a drive for setting the centrifuge plate in rotation, and has a device for supplying a medium to a front side and a rear side of the semiconductor wafer. The centrifuge has a housing which separates a centrifuging area and the semiconductor wafer from the environment, and a device for generating a laminar gas flow in the housing. A method for centrifuging a semiconductor wafer has the semiconductor wafer being centrifuged in a laminar gas flow.

Centrifuge and method for centrifuging a semiconductor wafer

A process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers, is such that the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF.

Process for the chemical treatment of semiconductor wafers

A device for cleaning semiconductor wafers with a cleaning liquid, includes a cleaning station with a plurality of rotating pairs of rollers which are arranged one behind another and to which the cleaning liquid is applied. Each pair of rollers is formed by a top roller and a bottom roller, and the semiconductor wafer is conveyed between the pairs of rollers. There is also a conveyor means for conveying the semiconductor wafer to and from the cleaning station. The conveyor means has a film of conveyor liquid which is provided by the conveyor and on which the semiconductor wafer is conveyed. A supplying container provides the cleaning liquid to the top rollers in the form of a falling liquid which migrates over the rollers. There is also a method for cleaning semiconductor wafers in which such a device is used.

Device and method for cleaning semiconductor wafers

A cleaning agent and method are useful for cleaning semiconductor wafers. The aqueous cleaning agent has a pH of 1 to 5, preferably a pH of 1 to 3, and contains at least one surfactant and at least one compound which belongs to a group of compounds comprising succinic acid and its derivatives. To clean the semiconductor wafers, a thin film of cleaning agent is generated on the side faces of the semiconductor wafers, preferably using a mechanical tool.

Cleaning agent and method for cleaning semiconductor wafers

Silicon wafers can be provided with a hydrophilic surface and/or freed of hering cement residues originating from the polishing operation with the aid of solutions adjusted to a pH of 8 to 14 with the aid of alkali-metal or alkaline-earth-metal compounds and containing hydrogen peroxide. These processes can even be carried out at room temperature and are remarkable for their low chemical consumption and easy manageability.

Process for the hydrophilizing and/or cement-residue-removing surface

Growing community of inventors

Reut, Germany

Roland Brunner