Semikron Elektronik Gmbh &co.kg

Semikron Danfoss Elektronik Gmbh & Co., Kg

Semikron Gmbh & Co., Kg

Roland Bittner

Marco Lederer

Sandro Bulovic

Johannes Klier

Rainer Popp

Alexander Wehner

Peter Lemke

Sven Teuber

Matthias Spang

Markus Beck

Klaus Backhaus

Jair Do Nascimento

Thomas Götze

Markus Müller

Matthias Kujath

Rene Hopperdietzel

Sebastian Hettrich

Peter Mauer

Alexander Suchan

Jochen Kraus

Christian Zeiler

Bernd Fischer

Robin Koschinski

Nicola Burani

Do Nascimento Jair

A power semiconductor arrangement has a switching facility, a housing, having a load connection facility for connecting in an electrically conductive manner to an external supply line and having a first plug-in connecting facility for plug-in connecting to an external second plug-in connecting facility. The housing has a first opening through which a connecting facility for connecting the load connection facility and the associated external supply line is accessible. A cover facility for covering the first opening is on the housing so as to be mechanically movable from a first end position into a second end position and has a first locking facility which cooperates with the external second plug-in connecting facility, whereby the first opening is closed with the cover facility as long as it is in its first end position, as long as the external second plug-in connecting facility is inserted into the first plug-in connecting facility.

Power semiconductor arrangement having a cover facility and method for releasing it

A circuit device has a power converter, which includes power semiconductor switches and a capacitor which is connected to a first and a second intermediate circuit conductor in an electrically conductive manner, and having a capacitor discharge device for the electrical discharging of the capacitor. The capacitor discharge device includes an actuation device, an electrical discharge resistor and a first semiconductor switch having a first and a second load current terminal, and having a control terminal. The first load current terminal of the first semiconductor switch is connected to the first intermediate circuit conductor via the discharge resistor, and the second load current terminal of the first semiconductor switch connects to the second intermediate circuit conductor. The actuation device on the control terminal of the first semiconductor switch generates an actuating voltage, in accordance with a control signal, for the closing and opening of the first semiconductor switch, and having a capacitor discharge monitoring device, which is designed to monitor an electric monitoring voltage which is present between the first load current terminal of the first semiconductor switch and the second intermediate circuit conductor and, in the event that the monitoring voltage is lower than a monitoring voltage limiting value, to generate a capacitor discharge signal.

Circuit device having a power converter and a capacitor discharge device

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device

A circuit configuration for controlling a power semiconductor device has a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first, and having a plastic molded body arranged in an intermediate space between the first and second circuit carrier, wherein the first circuit carrier has a first conductor track with a first contact point, which can be implemented in particular as a contact pad or as a contact receptacle, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component with a first and a second contact device, and wherein the first contact device is electrically conductively connected to the first contact point and the second contact device is electrically conductively connected to the second contact point.

Circuit configuration for controlling a power semiconductor device with two circuit carriers and a plastic molded body and arrangement having said configuration

A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.

Power electronic subassembly with capacitor

An arrangement comprising a power semiconductor module, a capacitor, a DC-voltage busbar and a connection device. The module has two flat DC-voltage connection conductors each having a contact section. The DC-voltage connection conductors are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction. The capacitor has two flat capacitor connection conductors each having a contact section. The DC-voltage busbar has two partial busbars each having a contact section. The connection device has a yoke with a die and a bearing. The respective contact sections of the DC-voltage connection conductors are clamped flat above one another between the die and the bearing. The contact sections, of the capacitor or the DC-voltage busbar, are arranged closely adjacent to one another on and close to the respective contact sections in the normal direction, and are thus force-fittingly and electrically conductively connected to one another.

Arrangement with a power semiconductor module, having a DC-voltage busbar and a capacitor

An arrangement having a DC-voltage busbar and a power component. The power component has two flat DC-voltage connection conductors, each with a contact section and arranged closely adjacent to one another. Each connection conductor has a clamping section beside the respective contact section in the direction of current flow. The busbar has two partial busbars, each with a contact section and arranged closely adjacent to one another. Each partial busbar has a clamping section beside the respective contact section in the direction of current flow. The contact section of at least one connection conductor is electrically connected to the contact section of the associated partial busbar by connecting the clamping sections of the connection conductor to the clamping section of the partial busbars in a flat and force-fitting manner above one another and the respective contact sections therefore lying directly flat on one another.

Arrangement having a power-electronic component and a DC-voltage busbar

A circuit for signal voltage transmission within a driver contains, on its primary side, a signal input for a first signal voltage, a current source for a current correlated with the first signal voltage, a connecting line for the current, the connecting line leading from the current source to the secondary side of the driver, and, on the secondary side, a current-voltage converter for converting the current into a second signal voltage correlated with the current, and a signal output for the second signal voltage. On the primary side, the first signal voltage is applied to the signal input, the current source generates a current correlated with the signal voltage, and the current passes to the secondary side via the connecting line. On the secondary side, the current-voltage converter converts the current into the second signal voltage and the second signal voltage is output at the signal output.

Circuit and method for signal voltage transmission within a driver of a power semiconductor switch

An isolating device for a power semiconductor comprising n power terminals for a power grid comprises n module terminals, n grid terminals, n connecting lines which connect the module terminals and grid terminals and have overcurrent fuses, and a tripping controller. The tripping controller includes a detector for detecting the rupture of an overcurrent fuse and a tripping unit for tripping an overcurrent fuse. A power module contains a power semiconductor and an isolating device. A system installation contains at least two power modules connected in parallel. In a method for operating an isolating device, at least one of the overcurrent fuses is tripped upon a predetermined tripping criterion being met.

Isolating device for a power semiconductor and method for its operation, power module and system installation

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Stegaurach, Germany

Roland Bittner