Bystronic Laser Ag

Roland Bader

Andreas Luedi

Titus Haas

Andreas Lüdi

Stefan Alfons Jacobi

Joël Baertschi

Matthias Schranz

Patrick Herwig

The invention relates to a calibration module for calibrating a real-time estimator, which is intended for quality estimation of a cutting method using a laser cutting machine, comprising: a load interface for loading a quality estimation result of the real-time estimator; a first processor, which is intended to provide a quality measurement result of the cutting edge of the workpiece, wherein the quality measurement result can be provided in particular by detecting measurement signals of a cutting edge of a finished cut workpiece by means of a measuring device; and wherein a second processor is intended to compare the loaded quality estimation result with the quality measurement result and based on the result: is intended to calculate a calibration data set for calibrating the real-time estimator an output interface (A) which is intended to output the calculated calibration data set.

Calibration of a quality estimator for a laser cutting method

A method for process monitoring of a laser machining process for estimating a machining quality is dicloses. The method may include steps, which are carried out in real time during the machining process of providing at least one captured first signal sequence with a first feature form a machining zone, providing at least one captured second signal sequence with a second feature from the machining zone, and accessing a trained neural network with at least the recorded first and second signal sequences in order to calculate a result for estimating the machining quality.

Quality control of a laser machining process using machine learning

Controlling a beam cutting device having a cutting tool is disclosed. A workpiece part can be cut out of a workpiece along a cutting contour. A cutting plan for the workpiece having a cutting contour for a workpiece part to be cut out of the workpiece is specified. Subsequently, the relative position of the workpiece and/or of the cutting plan and/or of the workpiece part to be cut out is determined. The relative position of the at least one support point of the workpiece support is determined. Subsequently, at least one risk region on the cutting contour of the workpiece part to be cut out is determined, followed by the defining of at least one starting-cut point and/or one cut-away point for the cutting tool on the cutting contour of the workpiece part to be cut out. A computer-implemented method and a beam cutting device is also disclosed.

Method for controlling a beam cutting device having a cutting tool, computer-implemented method for automatically defining and producing movement commands for controlling a cutting tool of a beam cutting device, and beam cutting device for carrying out the methods

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. According to the disclosure the cutting process is interrupted after a first partial processing step, whereupon a partial section (K. . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted, and the cutting process continued with the changed set of cutting parameters.

Laser process monitoring

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. The cutting process is interrupted after a first partial processing step, whereupon a partial section (K. . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted and the cutting process continued with the changed set of cutting parameters.

A laser-machining device includes an arrangement for producing and guiding a working laser beam. The arrangement includes a nozzle having an opening for emission of the working laser beam to a machining zone. An optical axis is defined in the arrangement and at least one element focuses the working laser beam near the opening of the nozzle. The machining process is monitored via at least one group of detector arrangements for a radiation characteristic of the machining process and an associated evaluating unit. The detector arrangements of each group are arranged in a ring shape about the optical axis. The observation direction of the detector arrangements extends, at least in a sub-region, between the focusing element closest to the machining zone and the machining zone, at a polar angle, in relation to the optical axis of the working laser beam.

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Rütschelen, Switzerland

Roland Bader