Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno

Roland Anthony Tacken

Erwin Rinaldo Meinders

Franky Flory Vercauteren

Hendrik Rendering

Renatus Marius De Zwart

Nicodemus Frederikus Kamperman

Lambertus Theodorus Gerardus Van De Vorst

Francois Furthner

Method and system for making a partially coated product () having at least one coated area () and at least one non-coated area (). Means () are provided for providing a digital representation of the product, including a cover layer () for each intended non-coated area which covers the intended non-coated area () and an isolation layer between them () which is isolated from the product's outside surface. A production device () is provided which is arranged to produce the product, including its respective cover and isolation layers under control of the digital representation. Means () for coating () the product are provided, including its respective cover layers. Finally, removing means () are provided which are arranged for removing the respective cover and, when applicable, isolation layers, including their coating, from the respective intended non-coated areas.

Method and apparatus for making partially coated products

The invention provides a method for preparing a pattern for an electric circuit comprising the steps of: (a) providing a substrate; (b) providing a pattern of an inhibiting material for an electrical circuit onto said substrate by i) applying a layer of the inhibiting material onto said substrate and mechanically removing locally the layer of the inhibiting material to obtain said pattern; or ii) applying a layer of the inhibiting material onto said substrate, wherein said layer has pre-determined pattern which incompletely covers said substrate; (c) establishing a distribution of particles of a first metal or alloy thereof on the layer of the inhibiting material and the pattern as obtained in step. (b); and (d) depositing by means of an electroless process a layer of a second metal or alloy thereof on the distribution of the particles of the first metal or alloy thereof as obtained in step (c), whereby the inhibiting material that is still present on the substrate after step (b) locally inhibits the second metal or alloy thereof to be deposited on the first metal or alloy thereof, ensuring that the second metal or alloy thereof will selectively be deposited on the particles of the first metal or alloy thereof that are distributed on the pattern obtained in step (b).

Method for preparing a patterned electric circuit

A method for partially metallizing a product comprising a first surface, a first polymer material, and a second surface, a second polymer material, wherein the method comprises the sequential steps of exposing the first and second surfaces to conditions which render the first surface hydrophilic, and the second surface hydrophobic; contacting the first and second surfaces with water or aqueous solution; contacting the first and second surfaces with a solution of a film former in a water-immiscible solvent; evaporating the solvent to allow formation of a film by the film former on the second surface; adherence of a film by the film former on the first surface is prevented by the presence of the water or aqueous solution thereupon; performing a conventional metallization process to deposit a metal layer on the first and second surface; and removing the metallized film from the second surface to render the first surface metallized.

Method for partially metallizing a product

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Geldrop, Netherlands

Roland Anthony Tacken