American Telephone & Telegraph Co., At&t Bell Laboratories

At&t Bell Laboratories

Roland A Levy

Martin L Green

Patrick K Gallagher

Edwin Arthur Chandross

Charles H Henry

Gerald Smolinsky

Robert E Dean

Ralph G Nuzzo

Thomas P Pearsall

Kurt Nassau

Michael Gurvitch

Frank Schrey

A method for fabricating a device, e.g., a semiconductor device, is disclosed which includes the step of reacting at least two reactive entities to form a metal-containing material on a region or regions of a processed or unprocessed substrate. Inherent in the method is the recognition that one of the reactive entities will often react with substrate material to produce previously unrecognized, and highly undesirable, results, e.g., the almost complete erosion of previously fabricated device components. Thus, and in accordance with the inventive method, any one of a variety of techniques is employed to reduce the reaction rate between the substrate material and the entity reacting with this material, while avoiding a substantial reduction in the reaction rate between the two entities.

Method for fabricating devices and devices formed thereby

In the manufacture of optical devices such as, e.g., optical communications assemblies and optical gyroscopes, low-loss substrate-supported optical waveguides are desired. Such waveguides can be obtained by patterning a layer of deposited waveguide material and, in the interest of minimizing loss as may be due to processing-induced surface roughness, waveguides as patterned preferably undergo a heat treatment which results in surface smoothing and in rounding of the waveguide cross section. Furthermore, in the interest of avoiding re-entrant corners between substrate and waveguide, a wetting layer may be applied to the waveguide prior to heat treatment.

Device including a substrate-supported optical waveguide, and method of

A hydrogen-free boron-containing membrane in tension exhibits advantageous properties for use as a mask in X-ray lithography.

Device fabrication by X-ray lithography utilizing stable boron nitride

A semiconductor device which includes either a single semiconductor chip bearing an integrated circuit (IC) or two or more electrically interconnected semiconductor chips, is disclosed. This device includes interconnects between device components (on the same chip and/or on different chips), at least one of which includes a region of superconducting material, e.g., a region of copper oxide superconductor having a T.sub.c greater than about 77K. Significantly, to avoid undesirable interactions, at high processing temperatures, between the superconducting material and underlying, silicon-containing material (which, among other things, results in the superconducting material reverting to its non-superconducting state), the interconnect also includes a combination of material regions which prevents such interactions.

Semiconductor devices having superconducting interconnects

Disclosed is a novel switching device. In its currently preferred embodiment the device comprises a conductive path that comprises a superconductive section, with the remainder of the path being non-superconductive, means for applying a voltage across the path such that a current flows, and means for changing the current in the path from a first value to a second value, where one of the two values is below, and the other is above, a critical current associated with the superconductive section of the path. Depending on the choice of applied voltage and path parameters changing the current from the first to the second state results in switching of the current, either oscillating between two levels of current, or to a steady value. Exemplarily, the current is changed by changing the applied voltage or by changing the resistance of the non-superconductive portion of the conductive path. The device can be used as, for instance, a microwave oscillator or a (binary) photodetector.

Triggerable superconductive switching means, and apparatus comprising

A glass reflow step to round off sharp edges of contact vias is typically included in processes for making integrated-circuit devices. In the course of making such devices with closely spaced vias, it has been found that unacceptable overhangs occur on the sidewalls of the vias. Neither changes in the composition of the glass nor modifications in the processing parameters of reflow were effective to avoid the overhang phenomenon. In accordance with the invention, it has been discovered that the overhang problem can be consistently avoided if the ratio of glass thickness to via-to-via spacing is about .ltoreq.0.393.

Contact vias in semiconductor devices

Chemical vapor deposition of an aluminum layer on a substrate is facilitated by surface activation prior to deposition. Surface activation is at relatively low temperature and results in a hydrated surface; low temperature surface activation is advantageous in the interest of keeping deposition apparatus free of additional chemicals, and substrates activated in this manner may be stored for considerable lengths of time prior to aluminum deposition. Among suitable activating agents are organochromium, organosilane, and organoaluminum compounds.

Chemical vapor deposition of aluminum on an activated surface

Conformal layers of a silicon oxide, such as silicon dioxide, are deposited at temperatures below 600 degrees C. through the decomposition of compounds such as diacetoxyditertiarybutoxysilane. The required temperatures do not significantly affect temperature-sensitive structures. Therefore, it is possible to form silicon oxide regions in the processing of devices having these structures. More generally, lowered-temperature processing can be applied to the deposition of other materials which include silicon oxide. For example, borophosphosilicate glasses can be deposited by chemical vapor deposition processing involving flash-evaporation of a mixture of liquid precursor reagents.

Growing community of inventors

Berkeley Heights, NJ, United States of America

Roland A Levy