Sandisk Technologies Inc.

Rohith Kamath

Shankara Venkatraman Gopalan

Shankar Ab

Amit Vijayvargiya

A semiconductor device package includes a first substrate extending along a first central plane, and a second substrate electrically connected to the first substrate and extending along a second central plane that is substantially parallel with and offset from the first central plane of the first substrate. One or more capacitors are electrically and mechanically connected to the second substrate via one or more leads. All of the one or more capacitors are positioned at the second substrate. All of the capacitors being positioned at the second substrate, reduces the complexity of and time required to manufacture the semiconductor device package.

Growing community of inventors

Bengaluru, India

Rohith Kamath