Cisco Technology, Inc.

Mavenir Systems, Inc.

General Electric Company

Qualcomm Incorporated

Lg Electronics Inc.

Gm Global Technolgoy Operations, Inc.

Emc IP Holding Company LLC

Mavenir Networks, Inc.

Strand Life Sciences Private Limited

Medgenome Inc.

Rohit Dev Gupta

Joel Richard Goergen

Shailesh R Nayak

Jatin Kohli

Robert Gregory Twiss

Damaruganath Pinjala

Viktor Brauer

Arjun Guzar Jayaprakash

Abhishek Mishra

Tamanna Jindal

Vipin Padlikar

Prashanth Pavithran

Manigandan Boopalan

Paolo Sironi

Mehmet Onder Cap

Stefan Schroeder

Simon Herbert Schramm

Ara Panosyan

Eva-Maria Baerthlein

Manjunatha Reddy Shivashankara

Shubham Maheshwari

Sarma V M K Vedhanabhatla

Tilak Gaitonde

Mohammed Ghouse

Parag Ghate

Chandra S Namuduri

Charles Calvin Byers

Chad M Jones

Luca Della Chiesa

Jason DeWayne Potterf

Piniwan Thiwanka Bandara Wijekoon

Asim Tewari

Malcolm Graham Smith, Jr

Emanuele Umberto Giacometti

Giovanni Giobbio

Garima Mishra

Rakesh Misra

Pawan Chhabra

Marc Henry Mantelli

Shanmukh Katragadda

Aby Kanneath Abraham

Ravi Gupta

Sudhir Borgonha

Kalyanasundaram Subramanian

Pinwan Thiwanka Bandara Wijekoon

Ramesh Hariharan

Suresh Kumar Vadivazhagan

Vamsi Veeramachaneni

Arjun Jayaprakash Guzar

Ramesh Babu Darla

Madhuri Chandrashekharaiah

Anand Janakiraman

Shilpa Agrawal

Arunabha Ghosh

Smita Agrawal

Sujaya Srinivasan

Bhupender Singh

Urvashi Bahadur

Shuba Krishna

Mahesh Nagarajan

Nimisha Gupta

Umeshbabu Nandanan

Narasimha Reddy Emmareddy

Sarma Vmk Vedhanabhatla

Amitabha Chaudhuri

Priyanka Shah

Malini Manoharan

Kiran V Paul

Radhakrishna Bettadapura

Mayukh Mallik

Naveen Kumar Bangalore Shiva Kumar

Chezhian Barathi

Vaijayanti Gupta

Robert Curto

Manimala Sen

Satish Sankaran

In one embodiment, an apparatus includes a module receivable in a modular electronic system, arms extending from a front panel of the module, and a cable support bracket connected to the arms. The cable support bracket is slidably connected to the arms to change a distance between the cable support bracket and the front panel of the module.

Adjustable cable management bracket for modular electronic system

A Shared Cell (SC) Controller uses deployment information, radio resource utilization measurements, cell load measurements, signal quality measurement, operator's policies and radio capabilities to make decisions on system configuration, re-configuration, and channel allocation related to the Shared Cell groups. The SC Controller may also use artificial intelligence/machine learning to predict future system state when making decisions on system configuration and channel allocation. The SC Controller can be implemented in the context of using a CBRS system, the ORAN architecture, and the Shared Cell group of Radio Units (RUs). SC Controller can be implemented as part of the Non-Real Time Radio Intelligent Controller (Non-RT RIC). The SC Controller interfaces with the Citizens Broadband Radio Service Device (CBSD) Controller, and the SC Controller sends the Shared Cell group information to the O-RU Controller so that the O-RU Controller can configure the radio components.

Method and apparatus for route aggregation handling for control and user plane separation

There is provided a method for a session audit in a communication system having a first plane and a second plane. The method can be employed in a case in which the first plane is a control plane and the second plane is a user plane, or a case in which the first plane is a user plane and the second plane is a control plane. The first plane performs operations of (1) sending to the second plane, an association update request that contains a first vendor-specific information element (IE) having (a) a bit set to indicate a desire for a single control plane (CP) fully-qualified session identification (CP F-SEID), and (b) a CP F-SEID, and (2) receiving from the second plane, an association update response that contains a second vendor-specific IE having (a) the CP F-SEID, and (b) a mapped user plane (UP) fully-qualified session identification (UP F-SEID).

Method and apparatus for session audit for control and user plane separation

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Heat sink assembly for electronic equipment

Aspects of the present disclosure provide techniques and apparatus for transferring data, such as between power domains via a first in, first out (FIFO) queue. An example method of transferring data includes selecting, via a source multiplexer, a first memory location included in a FIFO queue and storing first data, where the source multiplexer and the FIFO queue are in a first power domain; outputting the first data to a first level shifter; calculating, in the first power domain, a first value based on the first data; outputting the first value to a second level shifter; selecting, via at least one destination multiplexer included in a second power domain, the first level shifter and the second level shifter; calculating, in the second power domain, a second value based on the first data; and comparing the first value to the second value to generate a result.

Ensuring data integrity in power domain crossing FIFO queues

A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

Method and apparatus for maintaining cooling of modular electronic system during module removal

A combined User Plane (UP) node optimizes the UP data stream handling for 4G/5G network operation as follows. The combined UP node, which includes an access data plane node, an intermediate data plane node, an anchor data plane node, and a session handling process module. If the IP addresses or the namespaces of the access data plane node, the intermediate data plane node, and the anchor data plane node are different, then the downlink and uplink packet stream handling utilizes an intermediate interface path within the combined UP node. If the IP addresses or the namespaces of the access data plane node, the intermediate data plane node, and the anchor data plane node are same, then the downlink and uplink packet stream handling does not utilize an intermediate interface path within the combined UP node, but TEID of the unutilized intermediate interface path is used in PFCP response message.

Method and apparatus for user plane resource optimization

Embodiments herein describe preventing a pluggable module from connecting to a chassis until ensuring there is no damage on the pluggable module, the chassis, or both. In one embodiment, the chassis includes a blocking element that prevents or blocks the pluggable module from mating with the chassis. The chassis can also include a camera for capturing an image of the pluggable module to determine whether there is damage to its connection elements (e.g., pins). If not, the chassis can release the locking pin to permit the pluggable module to mate with connection elements on the chassis.

Module connector damage detection and controlled insertion

Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.

Dynamic control of heat sink pressure

Embodiments presented in this disclosure generally relate to a ground device. More specifically, embodiments disclosed herein are directed to a grounding device for indicating whether there is proper grounding for electrical equipment. One embodiment presented in this disclosure provides an apparatus. The apparatus generally includes a lug configured to be coupled to a physical ground node, the lug having one or more bolts for coupling the lug to a surface of a plate such that the physical ground node is electrically coupled to an electrical ground node. The apparatus also includes a sensing circuit configured to detect whether the physical ground node is electrically coupled to the electrical ground node, and provide an indication of whether the physical ground node is electrically coupled to the electrical ground node based on the detection.

Ground connection detection in an electronic equipment

A method for time sensitive network (TSN) operation includes: in the case of data traffic stoppage in a communication channel of TSN due to at least one of down time of a user plane (UP) connection and a reset of the UP connection, performing the following: generating, by a user plane function (UPF), an audit report about the at least one of the down time and the reset; sending, by the UPF, the audit report to a first element in control plane (CP), without waiting for communication from the CP; and determining, by one of the first element or a second element in the CP, survival time of the communication channel. The audit report is sent along with a report type indicating the down time of the UP connection due to connection fluctuation or a switch-over of the UP connection from a primary UPF to a back-up UPF.

Method and apparatus for survival time handling for time sensitive connections

A rack-mountable heat-exchanger for modular electronic systems is provided that include a heat exchanger including ambient air inlets and outlets forming an ambient airflow path in a first direction, and recirculating air inlets and outlets forming a recirculating airflow path in a second direction perpendicular to the first direction separated from the ambient airflow path; housing for an electronic device, the housing including internal air inlets and outlets forming an internal airflow path; a first duct configured to link the recirculating air outlet to the internal air inlet; a second duct configured to link the recirculating air inlet to the internal air outlet; and fan assemblies located one of the airflow path, configured to propel air through the heat exchanger in the respective airflow path.

Rack-mountable heat-exchanger for modular electronic systems

In one embodiment, an apparatus includes a fan tray comprising a plurality of fans for cooling modules within a modular electronic system with airflow from a front of the modular electronic system to a back of the modular electronic system, and a hinge member for connecting the fan tray to a front panel of the modular electronic system with the fans positioned in front of the modules. The fan tray is rotatable on the hinge member for movement away from the front panel to allow for replacement of one of the modules.

Front accessible fan tray with front-to-back cooling in a modular electronic system

In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Heat sink for optical module

Growing community of inventors

Bengaluru, India

Rohit Dev Gupta