Lam Research Corporation

Salesforce Com, Inc.

Salesforce, Inc.

Rohit Deshpande

Keith William Gaff

Eric A Pape

Tom A Kamp

Yoshie Kimura

Gowri Kamarthy

Victor Spivak

Wenhao Liu

Percy Dara Mehta

Alexander Oscherov

Alexis Roos

Noah William Burbank

Shardul Vikram

Robert Christopher Ames

Wing Hing Ku

Madhav Vaidyanathan

William Christopher Fama Roller

Alex Michael Noe

Joseph Gerald Keller

Madeleine Mary Gill

Bhaskar Garg

Xu Yang

Janelle Wen Hui Teng

Abraham Dio Suharli

Sammy Adnan Nammari

Nelson Esteban Acevedo

Ascander Dost

Sandeep Raju Prabhakar

Shuvajit Das

Nikita Mundhada

Oliver Qian Tang

Scott Roderick Young

A method and system for handling asynchronous data streams in a multi-tenant system. The process includes receiving at least a first stream of data and a second stream of data by a rules engine, determining by pattern matching of the rules engine, whether data in the first stream or data in the second stream meet conditions of a rule defined by a tenant of the multi-tenant system, and implementing by the rules engine the rule including a set of actions to modify data from the second data stream, in response to the data in the first stream matching the conditions the rule.

Merging multiple unsynchronized streams of related events and multi-tenant support

Methods, systems, and devices for analyzing communication messages (e.g., emails) and selecting corresponding actions are described. In some database systems, a user may receive multiple messages at a user device. To efficiently determine responses to these messages, the user device may send the messages to a backend server for analysis. The server may perform natural language processing (NLP) to classify the message with one or more binary classifications and may extract metadata from each message. Based on the classifications and the metadata, the server may determine one or more actions the user device may perform to respond to each message. The server may send instructions to the user device indicating the suggested actions, and the user device may display these actions as options to a user. Additionally, the user device may use the classifications and metadata to automatically generate one or more communication templates in response to the message.

Action response selection based on communication message analysis

Exemplary embodiments are directed to controlling CD uniformity of a wafer by controlling trim time on temperature in a plasma processing system. The plasma processing system has a wafer support assembly including a plurality of independently controllable temperature control zones across a chuck and a controller that controls each temperature control zone. The controller receives process control and temperature data associated with at least one wafer previously processed in a plasma chamber of the plasma processing system. The controller also receives critical device parameters of a current wafer to be processed in the plasma chamber. The controller calculates a target trim time and a target temperature profile of the current wafer based on the process control and temperature data of the at least one previously processed wafers and the critical device parameters of the current wafer. The current wafer as subjected to a trimming operation for a duration of the target trim time while controlling temperatures in the temperature control zones to thereby control temperature of each device die location based on the target temperature profile.

Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis

Exemplary embodiments are directed to controlling CD uniformity of a wafer by controlling trim time on temperature in a plasma processing system. The plasma processing system has a wafer support assembly including a plurality of independently controllable temperature control zones across a chuck and a controller that controls each temperature control zone. The controller receives process control and temperature data associated with at least one wafer previously processed in a plasma chamber of the plasma processing system, and critical device parameters of a current wafer to be processed in the plasma chamber. The controller calculates a target trim time and a target temperature profile of the current wafer based on the process control and temperature data, and the critical device parameters. The current wafer is trimmed during the target trim time while the temperature of each device die location is controlled based on the target temperature profile.

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Fremont, CA, United States of America

Rohit Deshpande