Schott Ag

Rohit Bhosale

Shaifullah Bin Mohamed Kamari

Robert Hettler

Amy Soon Li Ping

Matthias Rindt

Thomas Zetterer

George Lin Huikai

Tetsushi Morikawa

Josef Kiermeier

Lea-Li Chew

Martin Walter

A transistor outline package with integrated thermoelectric cooler is disclosed. The thermoelectric cooler is arranged on a heatsink which extends vertically into the housing of the transistor outline package.

Transistor outline package

A housing for radiation-emitting or radiation-receiving optoelectronic components such as LEDs and a method for producing the housing are provided. The housing has a base part and a head part that are joined by a glass layer. The top face of the base part defines an assembly region for an optoelectronic functional element and is also a heat sink for the optoelectronic functional element. The head part extends at least in sections over the peripheral extent of the assembly region, and above the assembly region it forms a passage area for the radiation emitted from or to be received by the optoelectronic functional element.

Housing for high-power LEDs

The electronic package contains an electronic component or components generating and/or receiving light-based signals, an optical element or elements for transceiving the signals and a housing encapsulating the electronic component or components. According to the invention the optical elements for transceiving the signals are diffractive/refractive optical elements (D/ROEs), which are also part of a sealing device for the housing. Accordingly, the diffractive/refractive optical elements (D/ROEs) have both optical and sealing functions.

Electronic package incorporating electronic components generating and/or receiving light-based coded signals

Growing community of inventors

Munich, Germany

Rohit Bhosale