Asm Technology Singapore Pte Ltd

Rogier Evertsen

Karel Maykel Richard Van Der Stam

Guido Martinus Henricus Knippels

Guido Knippels

Frank Ernst

Raph Pieters

Mark Müller

A method of singulating a semiconductor wafer with laser energy while the semiconductor wafer is supported on a mounting tape during singulation comprises the step of depositing a coating material onto a portion of the mounting tape adjacent to a perimeter of the semiconductor wafer to form a protective layer over the mounting tape. The semiconductor wafer is then cut with a laser beam such that the laser beam at least partially impinges upon the protective layer during cutting of the semiconductor wafer. After singulation of the semiconductor wafer, the protective layer is removed from the mounting tape.

Method of protecting a mounting tape during laser singulation of a wafer

A method of singulating a semiconductor wafer having two surfaces separated by a thickness T&#x3c;200 &#x3bc;m includes partitioning it along a network of scribelines on one side. The other side is secured to an elastic foil, which is clamped to a wafer table. A radiative scribing tool is used to produce at least one laser beam having a pulse duration P&#x2266;75 ps, and causing the laser beam to scan along each of the scribelines so as to create a scribe with a depth D&#x3c;T, thereby leaving the second surface intact. The foil is laterally stretched to sever the second major surface along the path of the scribes. In an embodiment, P&#x3c;C, the Time Constant of phonon-phonon coupling in the wafer at the location of incidence of the laser beam.

Method of singulating a thin semiconductor wafer

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Arnhem, Netherlands

Rogier Evertsen