Candescent Technologies Corporation

Other

Candescent Intellectual Property Services, Inc.

Advanced Technology Materials, Inc.

Silicon Video, Inc.

Roger W Barton

Christopher J Spindt

Duane A Haven

Bob Lee Mackey

John M Macaulay

Stephanie Jeanne Oberg

Michael James Nystrom

Arthur J Learn

Shiyou Pei

George B Hopple

Lawrence S Pan

Victoria A Bascom

Douglas M Smith

N Johan Knall

Jeffrey D Morse

Stephen C Wallace

Kollengode S Narayanan

Donald R Schropp, Jr

David L Bergeron

Theodore S Fahlen

John D Porter

Xueping Xu

Kishore K Chakravorty

Peter C Searson

Sudhakar Gopalakrishnan

Gabriela S Chakarova

Maria S Nikolova

James Montague Cleeves

Ramamoorthy Ramesh

James C Dunphy

Johan Knall

Ronald S Besser

Swayambu Ramani

John K O'Reilly

Vasil M Chakarov

William H Creel

Nils Johan Knall

Paul J Louris

A flat-panel display is fabricated by a process in which a spacer () having a rough face (or) is positioned between a pair of plate structure (and). When electrons strike the spacer, the roughness in the spacer's face causes the number of secondary electrons that escape the spacer to be reduced, thereby alleviating positive charge buildup on the spacer. As a result, the image produced by the display is improved. The spacer facial roughness can be achieved in various ways such as providing suitable depressions (, or) or/and protuberances (, and) along the spacer's face.

Fabrication of flat-panel display having spacer with rough face for inhibiting secondary electron escape

A method is provided for creating gated filament structures for a field emission display. A multi-layer structure is provided that includes a substrate, an insulating layer and a metal gate layer positioned on at least a portion of a top surface of the insulating layer. A plurality of patterned gates are also provided in order to define a plurality of gate apertures on the top surface of the insulating layer. A plurality of spacers are formed in the gate apertures at edges of the patterned gates on the top surface of the insulating layer. The spacers are used as masks for etching the insulating layer and forming a plurality of pores in the insulating layer. The pores are plated with a filament material that extends from the insulating pores, into the gate apertures, and creates a plurality of filaments. The spacers are then removed. The multi-layer structure can further include a conductivity layer on at least a portion of a top surface of the substrate.

Method for creating gated filament structures for field emission displays

The present invention provides a spacer assembly which is tailored to provide a secondary electron emission coefficient of approximately 1 for the spacer assembly when the spacer assembly is subjected to flat panel display operating voltages. The present invention further provides a spacer assembly which accomplishes the above achievement and which does not degrade severely when subjected to electron bombardment. The present invention further provides a spacer assembly which accomplishes both of the above-listed achievements and which does not significantly contribute to contamination of the vacuum environment of the flat panel display or be susceptible to contamination that may evolve within the tube. Specifically, in one embodiment, the present invention is comprised of a spacer structure which has a specific secondary electron emission coefficient function associated therewith. The material comprising the spacer structure is tailored to provide a secondary electron emission coefficient of approximately 1 for the spacer assembly when the spacer assembly is subjected to flat panel display operating voltages.

Tailored spacer wall coatings for reduced secondary electron emission

A method of fabricating a support structure. In one embodiment, the method is comprised of forming a layer of material into the support structure. The layer of material is adapted to be attached onto a substrate surface. The method further comprises treating the layer of material. The present method is further comprised of etching said layer of material. The fabricated support structure is then implementable during assembly of a display device. In one embodiment, the support structure is attached to the substrate surface prior to the forming, treating, and etching of the layer of material. In another embodiment, the support structure is attached to the substrate surface subsequent to the forming, treating, and etching of the layer of material.

Method of patterning wall and phosphor well matrix utilizing glass

A method of fabricating a support structure. In one embodiment, the method is comprised of providing a mold. The mold is for defining the physical dimension of the support structure. The mold is disposed upon a substrate surface. In one embodiment, the method is further comprised of depositing a powder into the mold. The present method is further comprised of compacting the powder deposited in the mold. The compacting forms the support structure. In one embodiment, the method is further comprised of removing the mold from the substrate surface upon which it is disposed. The removal of the mold exposes the support structure. The fabricated support structure is then implementable during assembly of a display device. In one embodiment, the powder deposited in the mold is a metal powder.

Method of forming powder metal phosphor matrix and gripper structures in wall support

A structure suitable for partial or full use in a spacer ( ) of a flat-panel display has a porous face ( ). The structure may be formed with multiple aggregates ( ) of coated particles ( ) bonded together in an open manner to form pores ( ). A coating ( ) consisting primarily of carbon and having a highly uniform thickness may extend into pores of a porous body ( ). The coating can be created by removing non-carbon material from carbon-containing species provided along the pores. A solid porous film ( ) whose thickness is normally no more than 20 &mgr;m has a resistivity of 10  ohm-cm. A spacer for a flat-panel display contains a support body ( ) and an overlying, normally porous, layer ( ) whose resistivity is greater parallel to a face of the support body than perpendicular to the body's face.

Constitution and fabrication of flat-panel display and porous-faced structure suitable for partial of full use in spacer of flat-panel display

A flat-panel display is fabricated according to a process in which a liquid-containing film ( , or ) is formed over a substrate ( ). In addition to suitable liquid, the liquid-containing film contains oxide or/and hydroxide. Liquid is removed from the liquid-containing film to convert it into a solid porous film ( or ) having (a) a porosity of at least 10% along an exposed face of the film, (b) an average resistivity of 10  ohm-cm at 25&deg; C., and (c) an average thickness of no more than 20 &mgr;m. A spacer ( ) formed with at least a segment of the substrate and overlying solid porous film is positioned between opposing first and second plate structures ( and ) of the display. The second plate structure ( ) emits light upon receiving electrons emitted by the first plate structure ( ).

Fabricating of a flat-panel displace using porous spacer

A flat-panel display contains a pair of plate structure ( and ) separated by a spacer ( ) having a rough face ( or ). When electrons strike the spacer, the roughness in the spacer's face causes the number of secondary electrons that escape the spacer to be reduced, thereby alleviating positive charge buildup on the spacer. As a result, the image produced by the display is improved. The spacer facial roughness can be achieved in various ways such as depressions ( , or ) or/and protuberances ( , and ). Various techniques are presented for manufacturing the display, including the rough-faced spacer.

Flat-panel display having spacer with rough face for inhibiting secondary electron escape

A flat panel display and a method for forming a flat panel display. In one embodiment, the flat panel display includes a cathodic structure which is formed within an active area on a backplate. The cathodic structure includes a emitter electrode metal composed of strips of aluminum overlain by a layer of cladding material. The use of aluminum and cladding material to form emitter electrode metal gives emitter electrode metal segments which are highly conductive due to the high conductivity of aluminum. By using a suitable cladding material and processing steps, a bond between the aluminum and the cladding material is formed which has good electrical conductivity. In one embodiment, tantalum is used as a cladding material. Tantalum forms a bond with the overlying resistive layer which has good electrical conductivity. Thus, the resulting structure has very high electrical conductivity through the aluminum layer and high conductivity into the resistive layer. Electrode structures that use resistor material, chromium-containing material, nickel and vanadium alloy, and gold are also disclosed.

Dual-layer metal for flat panel display

A structure that is suitable for partial or full use in a spacer of a flat-panel display. The structure may be formed with a porous body having a face along which multiple primary pores extend into the porous body. A coating consisting primarily of carbon and having a highly uniform thickness overlies the porous body's face, extending along the primary pores to coat their surfaces and converting the primary pores into further pores. The coating can be created by removing non-carbon material from carbon-containing species provided along the pores. A solid porous film whose thickness is normally no more than 20 &mgr;m has a resistivity of 10  ohm-cm. A spacer for a flat-panel display contains a support body and an overlying, normally porous, layer whose resistivity is greater parallel to a face of the support body than perpendicular to the body's face.

Constitution and fabrication of flat-panel display and porous-faced structure suitable for partial or full use in spacer of flat-panel display

Fabrication of an electron-emitting device entails providing an electron-emitting structure in which multiple sets of electron-emissive elements (24) overlying an emitter electrode (12) are arranged in a line extending generally in a specified direction. Each of a group of control electrodes (28) in the electron-emitting structure contain (a) a main control portion (30) penetrated by a control opening (34) that laterally circumscribes one of the sets of electron-emissive elements and (b) a gate portion (32) that extends across the control opening and has gate openings (36) through which the electron-emissive elements are exposed. Actinic material (38P) is provided over the control electrodes and processed to form a base focusing structure (38) penetrated by multiple focus openings (40) such that each focus opening is centered on a corresponding one of the control openings in the specified direction.

Fabrication of electron-emitting device having large control openings centered on focus openings

An electron-emitting device contains an emitter electrode (12), a group of sets of electron-emitting elements (,), a group of control electrodes (,), and a focusing system (,) for focusing electrons emitted by the electron-emissive elements. The sets of electron-emissive elements are arranged generally in a line extending in a specified direction. Each control electrode has a main portion (,) and a gate portion (,). the electron-emissive elements are exposed through gate openings (,) in the gate portion. The main portion of each control electrode crosses over the emitter electrode and has a large control opening (,) which laterally circumscribes one of the sets of electron-emissive elements. The focusing system has a group of focus openings (,) located respectively above the control openings. Each control opening is largely centered on, or/and is no more than 50% as large as, the corresponding focus opening in the specified direction.

Electron-emitting device having large control openings in specified, typically centered, relationship to focus openings

An electron-emitting device utilizes an emitter electrode (12) shaped like a ladder in which a line of emitter openings (18) extend through the electrode. In fabricating the device, the emitter openings can be utilized to self-align certain edges, such as edges (38C) of a focusing system (37), to other edges, such as edges (28C) of control electrodes (28), to obtain desired lateral spacings. The self-alignment is typically achieved with the assistance of a backside photolithographic exposure operation. The ladder shape of the emitter electrode also facilitates the removal of short-circuit defects involving the electrode.

Fabrication of electron-emitting device having ladder-like emitter

An electron-emitting device contains a vertical emitter resistor patterned into multiple laterally separated sections (34, 34V, 46, or 46V) situated between the electron-emissive elements (40), on one hand, and emitter electrodes (32), on the other hand. Sections of the resistor are spaced apart along each emitter electrode.

Patterned resistor suitable for electron-emitting device

Excess emitter material (52B) is removed in multiple steps during the fabrication of an electron-emitting device. A structure is initially provided in which a dielectric layer (44) overlies a non-insulating region (42), control electrodes (80 or 46/80) overlie the dielectric layer, openings (48/50) extend through the control electrodes and dielectric layer, electron-emissive elements (52A) formed with emitter material are situated in the openings, and an excess layer (52B) of the emitter material overlies the control electrodes and the dielectric layer. Portions of the excess emitter material overlying the dielectric layer in the spaces between the control electrodes are initially removed, preferably with etchant that directly attacks the emitter material. Portions (52C) of the excess emitter material overlying the control electrodes above the electron-emissive elements are subsequently removed to expose the electron-emissive elements.

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Tofte, MN, United States of America

Roger W Barton