Advanced Micro Devices Corporation

Spansion Llc.

Roger Tsao

David Michael Rogers

Michael Allen Van Buskirk

Darlene G Hamilton

Binh Quang Le

Fatima Bathul

Pauling Chen

Mimi Xuefeng Qian

Ou Li

Ken Tanpairoj

A reduced state memory device and methods of forming and programming multi-level flash memory cell element-pairs of the device, each element configured to store a blank level or two or more program levels are provided. In one embodiment, the reduced state memory device comprises a component configured to store in the memory cell element-pairs one pattern combination of a plurality of program pattern combinations comprising two blank levels, two program levels, and one blank level and one program level, the levels differing by less than a predetermined value. In one embodiment, a method of forming a memory device comprises forming at least one memory device of a multi-level flash memory array, each memory cell comprising two or more memory elements, each memory element configured to store three or more levels, and excluding one or more program pattern combinations that can be stored in the at least one memory cell.

Reduced state quadbit

A characterization method for a device under test includes applying a bias voltage to a test circuit. The test circuit includes a first transistor coupled to the device under test, a second transistor coupled to the device under test and to the first transistor. A third transistor is coupled to a dummy device, a fourth transistor is coupled to the dummy device and to the third transistor. The transistors are of a common type. The characterization method further includes applying non-overlapping clocking signals to transistors of the test circuit to produce test signals for application to the device under test and detecting a current in one or more transistors from the device under test. The bias voltage is further varied to characterize the device under test.

Clocked based method and devices for measuring voltage-variable capacitances and other on-chip parameters

A memory circuit senses current in a target cell during a read operation. According to one exemplary embodiment, the memory circuit comprises the target cell, a first neighboring cell, and an operational amplifier. The first target cell has a first bit line connected to ground; the target cell also has a second bit line connected to a drain voltage. A sensing circuit is coupled at a first node to at least one of the first bit line or the second bit line. The first neighboring cell has a third bit line connected to a second node. The operational amplifier has an output terminal connected at the second node to the third bit line. The operational amplifier has a noninverting input terminal connected to said first node, and also has an inverting input terminal connected to the second node.

Circuit for fast and accurate memory read operations

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San Jose, CA, United States of America

Roger Tsao