Xandex, Inc.

Roger Sinsheimer

D Evan Williams

Vladan Temer

Tom Richards

James C Anderson

Dave Teglia

Methods and apparatus are described for connecting a first plurality of signal lines to a second plurality of signal lines. A first assembly includes a plurality of first contact arrays. Each of the contacts in each of the first contact arrays is in electrical contact with a corresponding one of the first plurality of signal lines. Each of the first contact arrays has a first mechanical alignment feature associated therewith. A second assembly includes a plurality of contact assemblies. Each of the contact assemblies is suspended within the second assembly such that each contact assembly is operable to move independently in at least four degrees of freedom relative to the second assembly. Each contact assembly has a second contact array associated therewith. Each of the contacts in each of the second contact arrays is in electrical contact with a corresponding one of the second plurality of signal lines. Each of the contact assemblies has a second mechanical alignment feature associated therewith. The second contact array of each contact assembly is operable to align with a corresponding one of the first contact arrays through interaction of the first and second mechanical alignment features and movement of the corresponding contact assembly in at least some of the degrees of freedom.

Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment

A contact signal block for facilitating connections between test equipment and a device under test (DUT) is described. The contact signal block includes a plurality of ground layers and a plurality of signal transmission layers disposed between and alternating with the ground layers. Each signal transmission layer includes a plurality of signal conductors. Each signal conductor forms a controlled-impedance transmission line with adjacent ground layers and is terminated at a first end in a plurality of signal spring probes. A plurality of non-conductive spacer structures separates the ground layers and signal transmission layers and maintains a substantially constant separation between the ground layers and the signal conductors. The ground layers and the signal conductors are primarily separated by a medium having a loss tangent of approximately 0.002 and a dielectric constant of less than about 1.5.

Contact signal blocks for transmission of high-speed signals

A clamping assembly for connecting a first plurality of contacts to a second plurality of contacts on a circuit board. The circuit board has a first outer face and a second outer face. The second contacts are arranged on at least one of the first and second outer faces. The clamping assembly includes a first assembly having a first inner face, and a second assembly having a second inner face substantially parallel to the first inner face. The first plurality of contacts are arranged on at least one of the first and second inner faces. Mechanical alignment features facilitate alignment of the first contacts with the second contacts. The first and second assemblies are configured to enable relative motion therebetween to effect clamping of the first and second inner faces to the first and second outer faces of the circuit board.

A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.

A transmission line circuit is described which includes a conductive plane, a plurality of signal traces, and an intermediate layer between the conductive plane and the signal traces. The intermediate layer maintains a substantially constant separation between the conductive plane and the signal traces. At least a portion of the intermediate layer comprises air. The signal traces and the conductive plane form transmission lines.

Flex-circuit-based high speed transmission line

An apparatus for providing an electrical connection between a load board and a probe card assembly is described. The load board has a plurality of first contacts and is for interfacing with a test head. The probe card assembly has a plurality of second contacts and is for interfacing with a device-under-test (DUT). A load board assembly is provided for incorporating the load board. The load board assembly has a plurality of guide pins and either a plurality of cam members or a plurality of cam grooves. An electrical interface is provided having a plurality of conductive elements for establishing electrical contact between the first contacts and the second contacts. The electrical interface also has a plurality of apertures for receiving the guide pins thereby aligning the conductive elements with the first contacts. A cap ring is provided having the other of the plurality of cam members and the plurality of cam grooves. The probe card assembly has a plurality of apertures for receiving the guide pins thereby aligning the second contacts with the conductive elements. Rotation of the cap ring relative to the load board assembly engages the cam members in the cam grooves thereby compressing the electrical interface between the load board and the probe card assembly and establishing the electrical connection.

Prober-tester electrical interface for semiconductor test

A prober tester interface system and a method for loading a probe card into a prober. The interface system includes a stiffener for holding a probe card, the stiffener having an upper surface, a perimeter, an underside, a plurality of recesses in the underside around the perimeter, and first and second alignment holes. A theta ring for holds the stiffener in the prober, the theta ring having first alignment pins for engaging the first alignment holes, a plurality of lock cylinders for engaging the recesses, and a machined lip against which the upper surface of the stiffener is forced by the lock cylinders. A loader is coupled to the prober for loading the stiffener in and unloading the stiffener from the theta ring, the loader having second alignment pins for engaging the second alignment holes. A theta drive assembly is coupled to the theta ring for rotating the theta ring to align the probe card with the test head. In a specific embodiment, the test head includes a contactor, and the theta ring includes a plurality of clamp cylinders for locking the contactor in theta and Z while a probe card is being loaded or unloaded.

Probe card changer system and method

A method and apparatus are described for providing electrical connection between a first array of contact points and a second array of contact points via a layer of anisotropically conductive material in contact with the second array of contact points. A membrane is provided having a plurality of apertures therein for receiving the first array of contact points. A plurality of electrical contacts is also provided, each of the electrical contacts being coupled to the membrane and at least partially in registration with one of the plurality of apertures. The electrical contacts are for contacting the first array of contact points through the plurality of apertures. The electrical contacts are also for electrically connecting to the second array of contact points via the layer of anisotropically conductive material. Each of the electrical contacts is operable to move substantially independently of adjacent electrical contacts.

Membrane-supported contactor for semiconductor test

A prober tester interface system is described which includes a carriage having a plurality of cam followers on its perimeter and a cam ring having a plurality of cam grooves on its interior. Positioning means are detachably coupled to the carriage for positioning the cam followers in the cam grooves. Rotating means are coupled to the cam ring for rotating the cam ring, thereby causing the cam followers to track in the cam grooves and move the carriage in a direction substantially perpendicular to the plane of the cam ring. A method is also described in which a carriage having a probe card disposed therein and a plurality of cam followers on its perimeter is positioned in a cam ring having a plurality of cam grooves located on its interior to engage the cam followers in the cam grooves. The probe card is equipped with a plurality of test pins. The cam ring is then rotated, thereby causing the cam followers to track in the cam grooves and move the carriage in a direction perpendicular to the plane of the cam ring, thereby coupling the prober card to a test head. A semiconductor wafer is then brought into contact with the test pins and probed.

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Petaluma, CA, United States of America

Roger Sinsheimer