International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Other

Apple Inc.

Ati Technologies Inc.

Vette Corporation

Roger R Schmidt

Madhusudan K Iyengar

Robert E Simons

Michael J Ellsworth, Jr

Levi A Campbell

Richard C Chu

Milnes P David

Dustin W Demetriou

David P Graybill

Prabjit Singh

Vinod Kamath

Hendrik F Hamann

Timothy Joseph Chainer

Mark Edward Steinke

Donald W Porter

Bejoy J Kochuparambil

Eric Alan Eckberg

Robert K Mullady

James Andrew Lacey

Howard V Mahaney, Jr

Christopher R Ciraulo

Gerard Vincent Weber, Jr

Howard Victor Mahaney, Jr

Kenneth Robert Schneebeli

Randall G Kemink

Budy D Notohardjono

Dennis R Barringer

Scott Alan Shurson

Sukhvinder Singh Kang

William M Megarity, Jr

Evan G Colgan

Theodore Gerard Van Kessel

Yves Corfield Martin

John Harold Magerlein

Matthew R Archibald

Mark Delorman Schultz

Raschid Jose Bezama

Gary Franklin Goth

Takeshi Tsukamoto

Wade H White

Michael A Gaynes

Paul Alfred Lauro

Da-Yuan Shih

Pritish Ranjan Parida

John G Torok

Jason Aaron Matteson

Bruce Kenneth Furman

Edward Joseph Seminaro

John J Loparco

Francis R Krug, Jr

Randy J Zoodsma

Patrick Anthony Coico

William P Kostenko

Cary Huettner

Bret W Lehman

Martin Patrick O'Boyle

Jeffrey A Newcomer

Wayne A Barringer

Howard P Welz

George T Galyon

Steven J Mazzuca

Jason T Wertz

Dylan J Boday

Gregory Martin Chrysler

John Saunders Corbin, Jr

Steven C McIntosh

Kota V R M Murali

Jody A Hickey

Matthew A Nobile

Edward F Furey

Joseph P Corrado

Richard P Snider

Vidhya Shankar Venkatesan

Keith E Fogel

Eren Kursun

Supratik Guha

Hilton T Toy

David L Edwards

Gamal Refai-Ahmed

Charles Hampton Perry

Michael D Hillman

David Lewis Gardell

Martin Joseph Crippen

Kenneth Charles Marston

Steven John Ahladas

Gregory L Tice

David J Delia

Ethan E Cruz

James Dorance Gerken

Yoshinori Inoue

Maurice Francis Holahan

Dennis R Conti

Dales Morrison Kent

Paul M Gaschke

Peter W Kelly

Richard Lidio Blanco

Enrico A Romano

Ronald Jack Smith

Wei Zou

Yasuharu Yamada

Embodiments include a cooling device for a medical device. The cooling device including a controller configured to receive data from one or more temperature sensors and a pump, configured to be operated by the controller, to circulate a cooling fluid through a cooling system and through fluid channels in the medical device. The cooling device is configured to be worn by a user and to be selectively coupled to the medical device by the user.

Liquid cooling for medical devices

Apparatuses and methods are provided for blocking removal of an air-moving assembly from a housing when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the housing, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

Protective louver assembly for air-moving assembly

Apparatuses and methods are provided for protectively covering an air inlet or outlet of an air-moving assembly. The apparatus includes a protective cover assembly, which includes a retractable cover and a spring-biasing mechanism. The retractable cover transitions between a retracted state, when the air-moving assembly is operatively positioned within the chassis, and in extended state, when the air-moving assembly is withdrawn from the chassis. In retracted state, the retractable cover is retracted away from the air inlet or outlet, and in extended state, the retractable cover covers, at least partially, the air inlet or outlet. The spring-biasing mechanism is coupled to the retractable cover and biases the retractable cover in the extended state when the air-moving assembly is withdrawn from the chassis, and compresses to allow transition of the retractable cover to the retracted state as the air-moving assembly is inserted into operative position within the chassis.

Protective cover assembly for air-moving assembly

Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Effectiveness-weighted control of cooling system components

Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

Fuel vaporization using data center waste heat

Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Composite heat sink structures

A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

Thermoelectric-enhanced, inlet air-cooled thermal conductors

Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.

Liquid-cooled, composite heat sink assemblies

Growing community of inventors

Poughkeepsie, NY, United States of America

Roger R Schmidt