Ultratech, Inc.

Millipore Corporation

Roger R Coutu

Jill Svenja Becker

Ganesh Sundaram

Michael J Sershen

Douwe Johannes Monsma

Mark J Dalberth

Eric W Deguns

An ALD coating method to provide a coating surface on a substrate is provided. The ALD coating method comprises: providing a deposition heading including a unit cell having a first precursor nozzle assembly and a second precursor nozzle assembly; emitting a first precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; emitting a second precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; removing moving the substrate under the deposition head such that the first precursor is directed onto a first area of the coating surface prior to the second precursor being directed onto the first area of the coating surface.

Atomic layer deposition head

A gas deposition system () configured as a dual-chamber 'tower' includes a frame () for supporting two reaction chamber assemblies (), one vertically above the other. Each chamber assembly () includes an outer wall assembly surrounding a hollow chamber () sized to receive a single generation 4.5 (GEN 4.5) glass plate substrate through a load port. The substrate is disposed horizontally inside the hollow chamber () and the chamber assembly () includes removable and cleanable triangular shaped input () and output () plenums disposed external to the hollow chamber () and configured to produce substantially horizontally directed laminar gas flow over a top surface of the substrate. Each chamber includes a cleanable and removable chamber liner assembly () disposed inside the hollow chamber () to contain precursor gases therein thereby preventing contamination of chamber outer walls ().

ALD systems and methods

Method for high-velocity and atmospheric-pressure atomic layer deposition with substrate and coating head separation distance in the millimeter range

A reaction chamber assembly suitable for forming thin film deposition layers onto solid substrates includes a reaction chamber and an input plenum for receiving source material from gas source containers and delivering a flow of source material into the reaction chamber uniformly distributed across a substrate support width. An output plenum connected between the reaction chamber and a vacuum pump uniformly removes an outflow of material from the reaction chamber across the substrate support width. The input plenum is configured to expand a volume of the source material and deliver the source material to the substrate support area with uniform source material flow distribution across the substrate support width. The output plenum is configured to remove the outflow material across the entire substrate support width and to compress the volume of outflow material prior to the outflow material exiting the output plenum. The resulting source material flow over substrates supported in the substrate support area is uniformly distributed across the substrate support width and unidirectional with a uniform flow velocity. The configuration of the reaction chamber assembly reduces pump down times.

System and method for thin film deposition

A reaction chamber assembly for thin film deposition processes or the like includes an outer wall assembly for enclosing an outer volume and a removable liner installed into the outer volume through an outer aperture for preventing precursors or reactants from coming into contact with internal surfaces of the outer wall assembly and forming thin film layers thereon. The removable liner encloses a reaction chamber and includes substrate support trays or the like for supporting substrates being coated. Thin film layers are formed onto internal surfaces of the removable liner instead of onto surfaces of the outer wall assembly. The removable liner may be disposable or may comprise stainless steel, which can be removed when contaminated, cleaned by abrasive blasting such as bead blasting, and replaced. Two removable liners can be used to periodically swap removable liners and clean one of the liners while the other is in service with minimal disruption to production coating schedules. Other removable cleanable elements such as input and output plenums, door liners and conduits comprising stainless steel can be periodically removed and cleaned by abrasive blasting.

Reaction chamber with removable liner

A device for isolating and containing gas reactive materials includes a novel valve arrangement that is actuatable in conjunction with the movement of a pre-loaded metal diaphragm. The pre-loaded diaphragm force is sufficient to form a fluid tight seal when the device is disconnected from a gas supply line thereby sealing the interior of the device from the surrounding environment.

Apparatus for isolating and containing reactive medium

A device for isolating and containing gas reactive materials includes a novel valve arrangement that is actuatable in conjunction with the movement of a pre-loaded metal diaphragm. The valve is situated in a housing having an inlet and an outlet fitting, a seat for the diaphragm and a metal tube in contact with the diaphragm to provide fluid communication between the housing and the gas supply to that the pre-loaded diaphragm is opened upon the connection of the gas supply to allow gas flow to the gas reactive material disposed within the housing. The pre-loaded diaphragm force is sufficient to form a fluid tight seal when the device is disconnected from a gas supply line therby sealing the interior of the device from the surrounding enviroment.

Growing community of inventors

Hooksett, NH, United States of America

Roger R Coutu