Ciba Specialty Chemicals Corporation

Ciba-geigy Corporation

Huntsman Advanced Materials Americas LLC

Roger Pierre-Elie Salvin

Martin Roth

Adrian Schulthess

Kurt Meier

Yasuharu Nojima

Masato Hoshino

The present invention relates to a resin composition comprising an at least bifunctional prepolymer (A) curable under the action of heat, a telechelic elastomer and a particulate material having an elastomeric core and a thermoplastic shell. Layers and patterns which are produced using the formulation according to the invention have excellent adhesion properties, chemical stability, good electrical properties and high resistance to rapid temperature ranges. The compositions are suitable in particular as solder resists in the production of circuit boards.

Heat-curable resin composition

The claimed invention relates to a method for coating a substrate, preferably a printed circuit board, comprising the step of applying to said substrate surface a photopolymerizable water-borne aqueous-alkaline developable coating composition. The novel composition comprises a certain film-forming, acid group-containing acrylated derivative of an epoxy resin which is sufficiently neutralized with ammonia or an amine or an inorganic base to promote the formation of the corresponding ammonium or amine or inorganic base carboxylates by a neutralization reaction; a photoinitiator; water; and, optional components; as well as one or more additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light. The method produces coated substrates that are non-tacky after drying and that have good edge coverage.

Coating method using aqueous photopolymerizable compositions

Photopolymerisable compositions are described which comprise

Aqueous acrylic photopolymerisable compositions

There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates. Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of the polymers and copolymers. The novel compositions are photoimageable and are particularly suitable for use as solder resists.

Solder resist coating from photosensitive composition containing water

The invention relates to mixtures containing:

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Weil am Rhein, Germany

Roger Pierre-Elie Salvin