Fairchild Semiconductor Corporation

Roger Luo

Yong Liu

Zhongfa Yuan

Kevin Yang

Percy Shi

Jeff Ju

The disclosure provides a power supply circuit including an external power source, an ID pin provided in a universal serial bus (USB) port on a printed circuit board (PCB), and an internal power and signal management subsystem. The external power source is configured to power the internal power and signal management subsystem via the ID pin. A power supply method and a portable device are also disclosed.

Power supply circuit, method, and portable device

A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.

Growing community of inventors

Shanghai, China

Roger Luo