Kla-tencor Technologies Corporation

Samsung Electronics Co., Ltd.

Roger L Kroeze

Gary Janik

Chiyan Kuan

David Aitan Soltz

Ephraim Suhir

Edward Michael James

David A Crewe

Peter V Schwartz

Gregory W Grant

Thierry H C Nguyen

Salvatore T Fahey

Murali Narsimhan

K S Ravindhran

One embodiment involves an article of manufacture that includes: a copper substrate plug with a front surface and a back surface; a catalyst on top of a single surface of the copper substrate plug; and a thermal interface material on top of the single surface of the copper substrate plug. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate plug. The copper substrate plug is configured to be incorporated in a peripheral structure of a heat spreader or a heat sink. In another embodiment, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.

Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

A method of measuring properties of a sample using an electron beam. Coordinates of a measurement site on the sample, and a diameter of the electron beam are defined. Multiple measurement locations are determined within the measurement site, using the coordinates of the measurement site and the diameter of the electron beam. The measurement locations are selected such that the electron beam when directed at the multiple measurement locations (either through beam deflection or sample movement) substantially covers the measurement site. The electron beam is directed to the measurement locations and properties of the sample are measured at each of the measurement locations.

Site stepping for electron beam micro analysis

Methods and apparatus are providing for characterizing thin films in an integrated circuit device. A target including multiple layers is scanned using an x-ray emission inducer. X-ray emissions characteristic of materials in the target are measured. In one example, multiple beam energies are used to conduct the scan. In another example, continuously varying beam energies are used. Information such as K-ratios or the intensity of the x-ray emissions is provided to determine the thickness and/or composition of layers in the scan target.

Methods and apparatus for characterizing thin films

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San Francisco, CA, United States of America

Roger L Kroeze