Superconductor Technologies Inc.

Motorola Corporation

Skyworks Solutions, Inc.

Conexant Systems, Inc.

Agile Materials and Technologies, Inc.

Roger J Forse

Neal O Fenzi

Albert Humirang Cardona

Shiaw Wen Chang

Stephan M Rohlfing

Hassan S Hashemi

Wallace Y Kunimoto

Gregory Lynton Hey-Shipton

Evan S McCarthy

Trang Trinh

Michael J Scharen

Thuy Tran

Balam Quitzé Andrés Willemsen Cortés

William L Olson

Robert Armstrong York

David R Chase

Kevin Choi

George L Matthaei

Balam Quitz&eacute; Andr&euml;s Willemsen Cort&eacute;s

Jason Andrew Kronz

Balam Quitze Willemsen Cortes

David L Skoglund

Vicki Chen

Novel structures and methods for forming useful high temperature superconducting devices, most particularly resonators, are provided. Structures resulting in reduced peak current densities relative to known structures achieve numerous desirable benefits, especially including the reduced intermodulation effects of earlier resonators. In one aspect of this invention, a spiral in, spiral out resonator is provided, characterized in that it has an odd number of long runs, at least equal to five long runs, where the long runs are connected by turns, and wherein there are at least two sequential turns of the same handedness, followed by at least two turns of the opposite handedness. In yet another aspect of this invention, it has been discovered that reducing the size of the input and output pads of HTS resonators increases the relative inductance compared to the capacitance. Yet another resonator structure is a spiral snake resonator having a terminal end disposed within the resonator. A wide in the middle structure and wide at peak current density resonator structures utilize enlarged width portions of the resonator in those areas where current density is largest. In yet another aspect of this invention, operation of resonators in high modes, above the fundamental mode, reduce peak current densities. Resonators operated in modes in which current in adjacent long runs are in the same direction further serve to reduce current densities, and intermodulation effects. Symmetric current structures and modes of operation are particularly advantageous where far field effects are compensated for.

High temperature spiral snake superconducting resonator having wider runs with higher current density

A self-tuning variable impedance circuit provides improved performance. A variation in the power applied to the variable impedance circuit causes a corresponding change in the impedance of the circuit, resulting in improved performance. For example, the variable impedance circuit may be a matching circuit that 'follows' the output power of a power amplifier, thereby increasing the power efficiency of the power amplifier.

Self-tuning variable impedance circuit for impedance matching of power amplifiers

High temperature superconducting spiral snake structures and methods for high Q, reduced intermodulation structures

A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.

Multiple chip module with integrated RF capabilities

This invention provides a terminal arrangement for an electrical device. The electrical device includes a ground terminal on its outer surface that has a relatively large surface area. The electrical device also includes a plurality of contact terminals that are arranged around the periphery of the outer surface. Preferably, these terminals are generally equally-spaced from each other. Where the outer surface is rectangular, a terminal is normally located in each corner and one or more terminals are located along a side between the corners. The electrical device can be, for instance, a power amplifier. In such an arrangement, the amplifier is used to receive a radio frequency signal at a first side of the outer surface and output an amplified radio frequency signal from a second side of the outer surface. The power used to operate the amplifier is provided by power supply signals that typically enter at outer surface corners. Normally, a voltage reference signal is also supplied to the amplifier at another outer surface corner.

Terminal arrangement for an electrical device

Spiral snake high temperature superconducting resonator for high Q, reduced intermodulation

A printed circuit board comprises a metallic layer (,) cooperating with a metallic plate (,) to form a generally polygonal cross-section (,) of an integral waveguide (,) filled with a solid dielectric layer. The metallic layer (,) is on a substrate (,). The metallic layer (,) has a first strip (,) and a second strip (,) spaced apart from the first strip (,). A solid dielectric layer (,) overlies the metallic layer (,). The solid dielectric layer (,) has a first channel (,) exposing the first strip (,), a second channel (,) exposing the second strip (,), and a land (,) disposed between the first channel (,) and the second channel (,). A metallic plate (,) overlies the land (,), extends through the first channel (,) to the first strip (,), and extends through the second channel (,) to the second strip (,).

Printed circuit board having integral waveguide

High temperature superconducting structures and methods for high Q,

A temperature controlled cryogenic package system for efficiently and precisely monitoring and controlling the operating temperature of a high temperature superconductor circuit placed on a substrate. The cryogenic package system comprises a heating element formed on the same substrate as the high temperature superconductor circuit, a control circuit capable of activating and deactivating the heating element, and a temperature sensor placed in thermal proximity to the high temperature superconductor circuit. The temperature sensor monitors the operating temperature of the high temperature superconductor circuit, and conveys temperature information to the control circuit. The control circuit activates or deactivates the heating element according to the warming or cooling effect that is necessary in order to maintain the high temperature superconductor circuit within a predetermined temperature range, where the range of temperature fluctuation is within plus or minus 0.1 K of a predetermined temperature.

Temperature controlling cryogenic package system

A distributed transmission line structure (10) includes a ground plane (26) affixed to a substrate (12). The substrate (12) is formed of a generally nonconductive material. A first metallic strip (14) is affixed to the substrate (12) and is electrically connected to the ground plane (26) through a first through-hole (34). A second metallic strip (16) is affixed to the substrate (12) and is spaced apart from the first metallic strip (14) by a gap (28) and is electrically connected to the ground plane (26) through a second through-hole (38). A dielectric layer (20) overlies the substrate (12), the first metallic strip (14), and the second metallic strip (16). A third metallic strip (18) is affixed to the dielectric layer (20) and is disposed to overlie the gap (28). The third metallic strip (18) has a width less than the gap (28). The impedance of the distributed transmission line structure (10) is substantially constant over a predetermined range of thickness of the dielectric layer (20).

Distributed transmission line structure

Lumped element electrical components, such as inductors and capacitors, are formed to include high temperature superconducting materials. In the preferred embodiment, thin film epitaxial high temperature superconductors are patterned to form capacitors and inductors on low loss substrates. Preferably, a ground plane is formed on the back side of the substrate, most preferably being formed of high temperature superconducting material, or other highly conductive materials such as gold or copper. Various advantageous structures include a planar spiral structure, a zig-zag serpentine structure, a single coil structure and a double coil structure. Single layer and multilayer structures are included. Improved narrow bandpass filters and high Q resonator structures are formed.

High temperature superconductor lumped elements and circuit therefrom

Lumped element electrical components, such as inductors and capacitors, are formed to include high temperature superconducting materials. In the preferred embodiment, thin film epitaxial high temperature superconductors are patterned to form capacitors and inductors on low loss substrates. Preferably, a ground plane is formed on the back side of the substrate, most preferably being formed of high temperature superconducting material, or other highly conductive materials such as gold or copper. Various advantageous structures include a planar spiral structure, a zig-zag serpentine structure, a single coil structure and a double coil structure. Single layer and multilayer structures are included. Improved narrow bandpass filters, bandreject filters and high Q resonator structures are formed. Chebyshev bandpass filters are formed from multiple series connected zig-zag filter structures. Chebyshev, elliptic and quasi-elliptic bandreject filters are formed from a plurality of bandreject structures, each of which includes a zig-zag or serpentine inductor. A quasi-elliptic bandpass filter utilizes a plurality of series connected bandpass structures with planar cross-coupling of bandpass structures.

High temperature superconductor lumped element band-reject filters

Growing community of inventors

Santa Barbara, CA, United States of America

Roger J Forse