Motorola Corporation

Roger G Nikirk

Kalluri R Sarma

M John Rice, Jr

I Arnold Lesk

Donald R Clement

A method for the controlled melting of an end of a polycrystalline semiconductor body. The polycrystalline body is divided into two or more segments and the segments are positioned in a spaced apart relationship so as to be electrically isolated from each other by narrow gaps. One end of the segments is heated by an external heating means such as by induction heating to cause a portion of the end of the segments to melt. Some of the molten material so formed then flows into the gap separating the segments and electrically shorts together the segments. The opposite ends of the segments are connected to an electrical power supply and a heating current is passed through the segments and through the molten material bridging the gaps. Separately adjusting the heating effects of the external heating means and the heating current makes possible the controlled heating and controlled melting of the end portions of the segments.

Method for the controlled melting of semiconductor bodies

Polycrystalline silicon is produced by a high pressure plasma process. A silicon halide or halosilane is reacted with hydrogen in the presence of a high pressure plasma to deposit silicon on a heated substrate. The effluent from this reaction is collected, the silicon-bearing compounds separated out, and re-introduced to the deposition reaction. The initial silicon bearing compound can be inexpensive silicon tetrachloride. Maximum utilization of all silicon bearing reaction products maximizes polycrystalline silicon production efficiency.

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Tempe, AZ, United States of America

Roger G Nikirk