At&t Bell Laboratories

Bell Telephone Laboratories

Roger E Weiss

William Joseph Parzygnat

Rocco Bonanni

Max S Robin

Peter J Tamburro

David A Snyder

Disclosed is an apparatus for the optical interconnection of circuit packs and components mounted on circuit packs, and a method of manufacture. Optical fibers are bonded to a flexible substrate. The substrate includes tabs that can be terminated by standard V-groove silicon chip connectors for optical connection to the edges of circuit packs.

Optical interconnection of circuit packs

Disclosed is a connector which permits optical connections between a circuit pack and backplane. The optical components are mounted on a major surface of a circuit pack near the edge. Optical fibers are mounted within a housing which is secured to the backplane. The use of springs within the housing gives sufficient tolerances so that the fibers are aligned with the components when the circuit pack is inserted within a shelf.

Connector for coupling an optical fiber on a backplane to a component on

Described is a method for assembling multi-fiber array connectors. V-grooved silicon chips are placed in a holder which allows the chips to 'float' with respect to each other and adjust to varying fiber diameters. Once the fibers are inserted, the chips are clamped and cemented together with the fibers fixed in the grooves.

Method of assembling multi-grooved silicon chip fiber optic terminations

A high frequency modular connector (1) for use with a circuit board (2) to interconnect the circuit board with a backplane (3) of equipment mounting apparatus. The connector apparatus comprises connector modules (10, 12) each having a row and column configuration of first contacts (1014) for engaging the backplane with each first contact connected by a shielded conductor path (1010) with a corresponding second contact (1013) for engaging the circuit board. A conducting member (13) surrounds the first contacts and engages a spring conducting member (11) positioned between and electrically engaging the connector modules. The spring conducting member is biased in engagement with grounding apparatus of the backplane to provide a common ground for shielding the connector apparatus.

High frequency modular connector

A method and a system are disclosed for determining the wear of a drill bit in real time. At a predetermined point prior to engagement of the drill bit with the workpiece, a first rotational speed of the drill bit is ascertained. Upon exit of the drill bit from the workpiece a second rotational speed is determined. Measurement of these two rotational speeds enables a determination to be made of the loss of energy resulting from the drilling operation. This loss in energy is used to produce a measure of drill bit wear.

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Denville, NJ, United States of America

Roger E Weiss