Xanoptix Inc.

Cufer Asset Ltd. L.l.c.

Koninklijke Philips Corporation N.V.

Other

Cubic Wafer, Inc.

Roger Dugas

John A Trezza

Richard Stack

Mark Czoschke

Keith Kang

Hubert K Yeung

Michael Peszynski

Rodney J Solomon

Timothy Savord

David Chang Garner

Ross L Frushour

A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

Tooling for coupling multiple electronic chips

Wing portion of a butterfly-style inside-out heat sink

A system and method to facilitate receipt of an optoelectronic module in a first direction and make an electrical connection by movement of the module in a second direction different from the first direction.

Removable coupling of an opto-electronic module into a front access rack

An optical device has a mating piece constructed to accept and mate with a commercially available optical connector, an optical module, and a spacer located between the mating piece and the optical module, the spacer maintaining the mating piece and the optical module in alignment relative to each other in at least the Z direction and one other direction.

Method for relaxing mechanical tolerance in an opto-electronic unit

An ultrasound imaging system including an electromagnetically protected ultrasound TEE probe, a display for displaying ultrasound images, a housing including a transducer connector including at least one connection and a computer for processing electrical signals representative of received ultrasound echoes. The TEE probe includes a probe housing including an imaging sensor, an outer acoustic lens, a cable interconnect and an internal metal shield which surrounds the sensor and cable interconnect, and a cable including electrical conductors and electromagnetic cable shielding, the electrical conductors electrically connected to the cable interconnect at a first end, and the electrical conductors and the cable shielding are electrically connected to a transducer connector at a second end.

RFI-protected ultrasound probe

Inside-out heat sink

Communication module

Communication interface

Growing community of inventors

Chester, NH, United States of America

Roger Dugas