Other

Northrop Grumman Systems Corporation

Polar Semiconductor, Inc.

Limb Beaver, LLC

Westinghouse Norden Systems

Norden Systems, Inc.

Roger Carroll

William J Tanski

Emilio J Branciforte

Greg Nelson

William Tanski

Timothy Eschrich

In one aspect, a method includes depositing a first glass layer on a metallization layer and depositing an etch stop layer on the first glass layer. The method further includes depositing a second glass layer on the etch stop layer and polishing the second glass layer down to at least a surface of the etch stop layer.

Forming passivation stack having etch stop layer

A cutter apparatus comprising a frame having a mounting member connectable to a piece of prime mover equipment; a cutter assembly connected to the frame, the cutter assembly comprising a support member having a first end; a drive shaft having a first end journaled to the first end of the support member; and a plurality of discrete cutter members stacked on the drive shaft so as to be engaged with an adjacent one of the cutter members, each of the cutter members having at least one cutting edge; and a drive assembly connected to the drive shaft in a way that activation of the drive assembly causes the drive shaft to rotate and thereby rotate the cutter members. The frame may have a base and an extension arm pivotally connected to the base. The support member may be pivotally connected to the extension arm.

Cutter apparatus

A metal shield structure is provided for an integrated circuit (IC) having at least a first metal contact coupled to a fixed potential and a second metal contact. A first passivation layer is located between the first and second metal contacts and on a first portion of the first metal contact and a first portion of the second metal contact, leaving a second portion of the first metal contact and a second portion of the second metal contact uncovered by the first passivation layer. A metal shield layer is provided on the second portion of the first metal contact and on the first passivation layer, and a second passivation layer is formed on the metal shield layer.

Metal shield for integrated circuits

An improved electroluminescent display panel has a plurality of parallel metal assist structures deposited on a glass substrate, a plurality of parallel transparent electrodes are deposited over and aligned with the metal assist structures such that each metal assist structure is surrounded by a transparent electrode. A conventional stack of dielectric and phosphor layers and a plurality of metal electrodes is deposited thereon to complete the electroluminescent display panel.

Metal assist structure for an electroluminescent display

An improved electroluminescent display of the type having a substrate on which are applied ITO electrodes having dielectric, phosphor and dielectric stacks positioned thereon is formed with cavities between the stacks which expose a portion of each ITO electrode. The structure is annealed before or after the cavities are cut. Then a metal assist structure applied over the exposed portion of each ITO electrode. A planarization layer is applied over each metal assist structure and metal electrodes are placed to complete the display.

Method for manufacturing a low resistant electroluminescent display

An electroluminescent display includes a transparent electrode (4) and a metal assist structure (6) formed over a portion of the transparent electrode (6) such that the metal assist structure (6) is in electrical contact with the transparent electrode (4). The metal assist structure (6) includes a first refractory metal layer (10), a primary conductor layer (12) formed on the first refractory metal layer (10), and a second refractory metal layer (14) formed on the primary conductor layer (12). The first and second refractory metal layers (10, 14) are capable of protecting the primary conductor layer (12) from oxidation when the electroluminescent display is annealed to activate a phosphor layer (18). In an alternate embodiment, an electroluminescent display includes a substrate (2) and a metal electrode (22) formed on the substrate (2). The metal electrode (22) includes a first refractory metal layer (10), a primary conductor layer (12) formed on the first refractory metal layer (10), and a second refractory metal layer (14) formed on the primary conductor layer (12).

Low resistance, thermally stable electrode structure for

Flue cleaning apparatus comprises a bladed scraper head suspended by cable in a flue from pulleys on a mounting attachment secured at the top of the flue so that the cable can be operated from outside of a building of which the flue forms a part, to move the scraper head up and down in the flue for cleaning creosote and like deposits from the surfaces thereof. The scraper head incorporates alignment blades for guiding the scraper head off of irregularities which might be present in a flue, and a movable weight which can be used to hammer against the scraper head should it become lodged in a flue thereby assisting in dislodging same.

Flue cleaner and mounting attachment

A cutting guide for a blowtorch comprises a channel-shaped body member with front, back, and intermediate limbs, and a holder attachment for a blowtorch on its exterior. The back and intermediate limbs of the body member form a female slide member for receipt on a guide rail along which the body member is moved while cutting a metal plate or the like. The front limb is spaced forwardly of the intermediate limb to form a splatter shield protecting the female slide member against molten metal and slag formed while cutting, so as not to impede smooth sliding of the guide along the rail.

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Willimantic, CT, United States of America

Roger Carroll