Northern Telecom Limited

Roger C Finn

Reginald B Bennett

Allan R Drake

Raymond Kenneth Orr

William P Trumble

Morley Scott MacKenzie

Charles F Jackson

A method of providing a predetermined set distance apart between two members in article manufacture. This involves clamping the members together with a mixture of an adhesive and glass microspheres between opposing surfaces of the members, the microspheres being of specific grid size. The largest diameter microspheres are gripped between the opposing surfaces thereby determining the distance between the members. The invention is particularly useful for precise location apart between members with small gaps therebetween, e.g. less than 3 mil. It is useful particularly for magnetic device cores of small dimensions.

Method of controlling distance between members during article

The invention provides a method of applying an overlay conductor between at least a pair of connection land areas on a surface of a printed circuit board. The pattern of the conductor is first defined by the application of a dielectric material between the pair of land areas. A silver polymer ink is then applied over the dielectric material and over only a portion of each land area. The polymer ink is then cured by exposure to a source of heat. The pair of land areas and at least the portion of the cured ink overlaying the land areas are then covered with silver solder paste which is subsequently reflowed by exposure to a source of heat and allowed to solidify thereby attaching the conductor to the land area and providing a secure conductive connection.

Process for application of overlay conductors to surface of printed

The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink.

Process for forming silver conductors on a substrate

An optical fiber splice comprises two coated fibers, generally of fused silicon, fusion spliced end-to-end. The coating is removed from the ends of the fibers for a short distance prior to fusion. After fusion the uncoated ends and a short length of coated fiber, each side of the fusion joint, are encased in a synthetic resin. Conveniently, the resin is molded about the fibers and is cured by radiation, such as UV light, bright visual light and ion bombardment. The resin may contain reinforcement material.

Optical fiber splice

A splice between ends of a pair of telecommunications cables is encapsulated in a thermoset foam. To encapsulate the splice it is positioned within a mold with the cables extending through apertures in the mold. At the apertures the cables are wrapped with an open cell foam material to block the cavity ends. A foam base material is then mixed with an activating agent which includes both a heat activated blowing agent and a material which reacts exothermically with the foam base material. The mixture is deposited within the mold and the mold closed. The mixture then foams to fill the mold and rapidly cures. The resulting joint is light, durable, waterproof and re-enterable.

Growing community of inventors

Nepean, Canada

Roger C Finn