Electrochemicals, Inc.

Omg Electronic Chemicals, Inc.

Macdermid Enthone Gmbh

Macdermid Enthone America LLC

Roger Bernards

Benjamin Todd Carroll

Alvin A Kucera

Joseph Stanton Bowers, Jr

Al Kucera

Mike Schanhaar

Joseph S Bowers

Hector Gonzalez

Beth Ann LaFayette

Richard Bellemare

Jason J Carver

Thao Pham

James Martin

A method of preparing a non-conductive substrate to allow metal plating thereon. The method includes the steps of a) contacting the non-conductive substrate with a conditioner comprising a conditioning agent; b) applying a carbon-based dispersion to the conditioned substrate, wherein the carbon-based dispersion comprises carbon or graphite particles dispersed in a liquid solution; and c) etching the non-conductive substrate. The etching step is performed before the liquid carbon-based dispersion dries on the non-conductive substrate.

Carbon-based direct plating process

The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

Solution and process for improving the solderability of a metal surface

A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions and an oxidizing agent present in amounts effective to strip nickel. An aqueous solution comprises about 1% to about 10% by weight hydrogen peroxide and about 5% to about 30% by weight of an ammonium phosphate. A method of pre-treating a copper substrate comprises providing a printed wiring board having a copper substrate and contacting the copper substrate with phosphate ions, and an oxidizer. A method of neutralizing permanganate on a printed wiring board comprises providing a printed wiring board with a permanganate residue on the printed wiring board and contacting the permanganate residue with phosphate ions, and an oxidizer.

Method and composition for selectively stripping nickel from a substrate

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates

The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.

Method for roughening copper surfaces for bonding to substrates

A corrosive composition, such as an alkaline aqueous carbon dispersion, a cleaner, a cleaner conditioner, or a conditioner, comprises a corrosion inhibitor, e.g., benzotriazole. The corrosion inhibitor is present in an amount effective to reduce or stop the dissolution of metal from a metallic surface, such as a printed circuit board, in contact with the composition. A method to reduce or stop the dissolution of metal from a metallic surface in contact with a corrosive composition, and a method to stabilize or recover a corrosive composition containing metal contaminants by adding an effective amount of a corrosion inhibitor to the corrosive composition.

Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)

A method for preventing a carbon dispersion from increasing in viscosity during use is described. The dispersion comprises graphite particles or carbon black particles or a combination of both dispersed in a fluid. The method involves lowering the susceptibility of the carbon dispersion to an increase in viscosity or ionic strength by lowering its pH or reducing its exposure to reactive components in the ambient atmospheric gas. The pH can be lowered by at least partially removing ammonia from the dispersion, or by adding a material that reduces the pH of the dispersion. The stability of the dispersion can also be improved by isolating the dispersion from reactive atmospheric gas. The stabilized aqueous carbon dispersion can have a viscosity of less than about 20 cps and a conductivity of less than about 3 mS.

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South Haven, MN, United States of America

Roger Bernards