Lucent Technologies Inc.

Agere Systems Guardian Corp.

Agere Systems Optoelectronics Guardian Corp.

Roger Anthony Fratti

John Wayne Bowen

Douglas D Lopata

James D Yoder

Dwight David Daugherty

Xiaohong Jiang

Melvin West

There is disclosed a power amplifier includes an in-phase power splitter generating two split signals from an input signal, and two amplifiers capable of operating in different modes. The split signals are provided as respective inputs to the two amplifiers which are coupled through transmission lines such that as the first amplifier approaches the maximum power it can produce, the output from the second amplifier begins to contribute to the power amplifier output and supplements and modifies the power provided by the first amplifier thereby extending the range of input power over which the power amplifier delivers output power.

Efficient power amplifier

An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.

Self alignment device for ball grid array devices

A transmission line balun transformer for providing a single ended output signal from a pair of differential input signals includes two transmission line signal couplers. The couplers are individually designed to be relatively loosely coupled devices, i.e. having a coupling factor greater than 3 dB, but are coupled together with proper phase relationships so as to achieve a relatively tighter composite coupling characteristic in the order of 3 dB, thereby resulting in an increase in bandwidth.

Wideband balun for wireless and RF application

A ring-shaped device is provided for protecting an electrostatic discharge sensitive electronic component. The protective device has a thin film support structure, adhesive material for securing the support structure to the leads of the electronic component, and conductive material for electrically connecting the leads together. The adhesive material may be a pressure sensitive adhesive. The conductive material may be an annular layer of metal deposited on the support structure. In addition, a central opening is provided in the support structure to accommodate a top portion of the electronic component. The electronic component may be protected while it is stored, handled and assembled into a larger system or device, such as a circuit board. The protective device may be used with a variety of electronic components, including components with different leads configurations and also taped components. The present invention is also applicable to a taped electronic components assembly that provides electrostatic discharge protection.

Device and method for protecting electronic component

Circuits having switched capacitors that are implemented with T-structures in which one of the three capacitors in the T-structure is implemented with a buffer amplifier configured to receive a control signal (e.g., a control voltage) and to apply a buffered control signal to an active device having a capacitance that is dependent on the control signal level. In one embodiment, the control signal is a control voltage, the active device is a varactor diode, and the circuit is a ladder filter having one or more switched capacitors, each of which is implemented using the T-structure of the present invention. Under the present invention, continuously tunable circuits can be implemented with discrete elements where the circuits can be tuned by changing the control signal in one or more of the switched capacitors, without having to provide a continuously tunable clock.

Continuous tuning of switched capacitor circuits using DC-isolated

A fully integrator RF attenuator performs gain control upon a received RF signal without the use of an off-silicon PIN diode. The attenuator includes a T-configuration pad in conjunction with a current source. A direct current signal biases a shunt element in the T-pad. Preferably, a voltage control signal which controls the direct current is generated as a negative feedback signal in proportion to the magnitude of the RF detected at the attenuator output.

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Cumru, PA, United States of America

Roger Anthony Fratti