Johnson Matthey Electronics, Inc.

Honeywell International Inc.

Stats Chippac Pte. Ltd.

St Assembly Test Services Inc.

Roger Alan Emigh

Seng Guan Chow

Il Kwon Shim

Janine K Kardokus

Ming Ying

Nancy F Dean

John Alden Dunlop

Charles Smith

Jun Yuan

Michael M Chau

Sheila Marie L Alvarez

Virgil Cotoco Ararao

Michael R Pinter

Timothy Knowles

Christopher L Seaman

William Bryce Willett

Mani Ahmadi

Brett M Ellman

A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.

Integrated circuit protruding pad package system and method for manufacturing thereof

An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.

Integrated circuit protruding pad package system

A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.

Stacked die packaging and fabrication method

A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat dissipation region, a lower substrate contact region, and supports connecting the upper heat dissipation region and the lower substrate contact region. A recess is formed within the supports and the upper and lower regions for receiving a semiconductor device.

Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices

Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.

Electronic device having fibrous interface

Described is a fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and beneath the free tips of the fibers.

Compliant fibrous thermal interface

A sputtering target comprising a body of metal such as aluminum and its alloy with an ultrafine grain size and small second phase. Also described is a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece, and fabricating the workpiece to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous, transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing grain size of still smaller size and controlled grain texture.

Sputtering target with ultra-fine, oriented grains and method of making

Described is a method of manufacturing a sputtering target or backing plate for a sputtering target that minimizes metal waste and reduces manufacturing steps. The target or backing plate is made from a substantially circular metal blank by progressively deforming circumferential bands until the blank is in the shape of a sputtering target or backing plate. The target and backing plate so produced are also described.

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Post Falls, ID, United States of America

Roger Alan Emigh