Carrier Corporation

Rosemount Aerospace Limited

Roger Alan Backman

David Patrick Potasek

John Carl Christenson

Ben Ping-Tao Fok

Jon K Evju

Anand Venkatesh Sankarraj

Gary Follett

Thi A Nguyen

Siqi Wei

A combustible gas sensor that includes a reference sensor. The reference sensor includes a first substrate having a first substrate first surface, a first insulating layer disposed on the first substrate first surface, and a first heater at least one of embedded within the first insulating layer and disposed on the first insulating layer. The first substrate is a MEMS substrate.

Combustible gas sensor

A gas detection device is provided. The device includes a substrate and a dielectric material applied to the substrate. A sensor material is applied to the dielectric film. The sensor material has a bottom, a side, and a top surface. An electrode material is at least partially applied to the dielectric film and at least partially applied to a portion of the side of the sensor material and a portion of the top surface of the sensor material to pin a portion of the sensor material to the dielectric material. The electrode material forms a vapor barrier upon the sensor material to facilitate preventing delamination between the sensor material and the electrode material over portions of the sensor material where the sensor material is not pinned to the dielectric material.

Gas detection device and method of manufacturing the same

An isolated sensor and method of isolating a sensor are provided. The isolated sensor includes a mounting portion, a sensor portion disposed adjacent to the mounting portion, and at least one pedestal connecting a mounting portion to a sensor portion.

Isolated sensor and method of isolating a sensor

A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.

Thermally-matched piezoresistive elements in bridges

A micro-fuse assembly includes a substrate, a number of thin-film micro-fuses on the substrate, and a topping wafer configured to sealingly engage to at least one of the substrate or the thin-film micro-fuses to define a cavity therebetween. The cavity is configured to encapsulate the thin-film micro-fuses within an inert environment sealed within the cavity. A method of encapsulating a micro-fuse assembly within an inert environment using a topping wafer is also disclosed.

Growing community of inventors

Minneapolis, MN, United States of America

Roger Alan Backman