International Business Machines Corporation

Roger A Rippens

Daniel Mark Dreps

Kevin Charles Gower

Frank David Ferraiolo

Mark William Kellogg

Donald J Swietek

Pak-kin Mak

Bruce G Hazelzet

Kevin W Kark

Raymond J Harrington

Gerald J Fahr

Eric B Hultmark

Liyong Wang

Carl B Ford, Iii

Raymond L Ricci

Frank P Presti

Frank D Ferriaolo

Bruce E Blake

George Crowder

A dual inline memory module (DIMM) includes a card having a length of about 151.2 to about 151.5 millimeters, a plurality of individual local memory devices attached to the card, and a buffer device attached to the card, the buffer device configured for converting a packetized memory interface. The card includes at least 276 pins configured thereon.

276-pin buffered memory module with enhanced fault tolerance

A system and method for providing an adapter for re-use of legacy DIMMS in a fully buffered memory environment. The system includes a memory adapter card having two rows of contacts along a leading edge of a length of the card. The rows of contacts are adapted to be inserted into a socket that is connected to a daisy chain high-speed memory bus via a packetized multi-transfer interface. The memory adapter card also includes a socket installed on the trailing edge of the card. In addition, the memory adapter card includes a hub device for converting the packetized multi-transfer interface into a parallel interface having timings and interface levels that are operable with a memory module having a parallel interface that is inserted into the socket. In addition, the hub device converts the packetized multi-transfer interface into a parallel interface having timings and interface levels that are operable with a memory module having a parallel interface that is inserted into the socket. The hub device also converts the parallel interface into the packetized multi-transfer interface.

System and method for providing an adapter for re-use of legacy DIMMS in a fully buffered memory environment

A DDR SDRAM DIMM for a mainframe main storage subsystem has a plurality of DDR SDRAMs on a rectangular printed circuit board having a first side and a second side, a length (152 MM=6 inch) between 149 and 153 millimeters and optimized at 149.15 mm or 151.35 mm in length and first and second ends having a width smaller than the length; a first plurality of connector locations on the first side extending along a first edge of the board that extends the length of the board, a second plurality of connector locations of the second side extending on the first edge of the board, a locating key having its center positioned on the first edge and located between 80 mm and 86 mm and optimized with a locating key 1.5 mm wide centered at 81.58 or 85.67 mm from the first end of the board and located between 64 and 70 mm and optimized with the locating key centered at 67.58 or 65.675 from the second end of the board. Each DIMM has memory regions comprising one of a plurality of physical entities hereafter referred to as memory macros which are relocatable regions which contain SP Keys and data set storage in the DIMM physical memory. These memory macros SP Key regions define an arbitrary logic structure for main storage which has a hard physical boundary.

Processor memory array having memory macros for relocatable store protect keys

A dual inline memory module (DIMM) includes a card having a length of about 151.2 to about 151.5 millimeters, a plurality of individual local memory devices attached to the card, and a buffer device attached to the card, the buffer device configured for converting a packetized memory interface. The card includes at least 276 pins configured thereon including a plurality of high-speed bus interface pills arranged on said card for communicating with a plurality of high-speed busses. The high-speed bus interface pins associated with a single high-speed bus are located on one side of the card with respect to a midpoint of the length of the card, thus the pin assignments are defined such that the performance of the DIMM in a system is optimized for high frequency operation.

276-Pin buffered memory module with enhanced fault tolerance and a performance-optimized pin assignment

A memory system including a first and second of set of socket pads adapted for connection to memory module continuity pins. The memory system also includes a first indicator corresponding to the first set of socket pads. The memory system also includes a second indicator corresponding to the second set of socket pads. The first indicator is active and the second indicator is inactive when the first and second set of socket pads are empty. The first indicator is inactive and the second indicator is inactive when then first and second set of socket pads contain the continuity pins. The first indicator is inactive and the second indicator is active when the first set of socket pads contain the continuity pins and the second set of socket pads is empty.

System for indicating a plug position for a memory module in a memory system

276-Pin buffered memory module with enhanced fault tolerance

A system and method for reducing coupled noise in a multilayer circuit board having signal lines disposed within a set of wiring channels on each of a plurality of the layers; and, a vias disposed within a set of via channels. According to a first embodiment, otherwise unused vias traverse the layers and are connected with otherwise unused signal lines to form electrical nets, thus reducing coupled noise throughout the module. In the context of the above-described environment, a method for reducing coupled noise includes the steps of determining the locations of unused ones of the wiring channels and unused ones of the via channels; providing shield lines disposed within the unused wiring channels and unused via channels; and, interconnecting the shield lines with one another and to a reference voltage by way of at least one terminating resistance.

Post processing shielding

A ceramic card assembly which provides high density three dimensional semiconductor device packaging and overcomes the power distribution and thermal management problems that have impaired prior ceramic cards. The ceramic card assembly combines ceramic cards with flexible power distribution structures which provide low inductance and low resistance power distribution, making ceramic cards available for high performance VLSI systems. Each ceramic card assembly comprises a ceramic card having a plurality of chip sites and power contacts thereon, and at least one flexible power distribution structure having alternating insulation (i.e. polyimide) layers and conductor (i.e., copper) layers, the flexible power distribution structures are mounted adjacent to the ceramic cards so that conductive layers of the ceramic cards are selectively exposed to the power contacts. The ceramic card assemblies are preferably combined into a field replaceable unit that includes cold plates between ceramic cards. High density packages further include ceramic in-line packages which quadruple current day memory density.

Ceramic card assembly having enhanced power distribution and cooling

Growing community of inventors

Salt Point, NY, United States of America

Roger A Rippens