3m Innovative Properties Company

Roger A Grisle

Richard Yufeng Liu

Nathaniel I Lehn

Jeffrey W McCutcheon

Michael C Martin

Robin E Gorrell

Benjamin J Bending

Shujun J Wang

Jeanne M Bruss

Chin Teong Ong

Yi Lin Sim

Harold T Munson

Yaoyao Chen

An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer borne on a major surface of the support layer. The curable adhesive layer includes a rubber elastomer and a thermal curing agent.

Protective tapes, articles therefrom, and methods of making and using same

Hot melt processable adhesive compositions to mask electronic components include at least one block copolymer, at least one tackifying resin, at least one semi-crystalline polyolefin polymer, at least one plasticizer, and at least one anti-oxidant. The adhesive composition is a hot melt processable pressure sensitive adhesive composition that is thermally stable, such that the composition when disposed on a surface withstands heating to 260&#xb0; C. without degradation or flowing, remains optically transparent, and after heating to 260&#xb0; C. remains cleanly removable.

High temperature resistant masking adhesive composition

Adhesives including a polyester at 20 to 50 weight percent, a first tackifier at 30 to 60 weight percent, and a first olefin-styrene block copolymer at 5 to 30 weight percent are described. The polyester has a glass transition temperature between &#x2212;40&#xb0; C. and &#x2212;10&#xb0; C., and the adhesive has a heat activation temperature between 20&#xb0; C. and 100&#xb0; C. Damping films including at least one layer of the adhesive and including a foamed layer are described. The foamed layer includes a second olefin-styrene block copolymer at 30 to 80 weight percent and a second tackifier at 15 to 60 weight percent.

Adhesive and damping film

Flexible films including an electrically conductive layer being sandwiched by two electrically insulating layers in a layered structure are provided. The layered structure extends continuously from at least one first zone to at least one second zone along a lateral direction of the flexible film, and the at least one first zone is positioned around a periphery of the respective at least one second zone. In the at least one first zone the three layers are at least partially intermixed with each other to provide an electrically conductive surface in the at least one first zone on the side of the first major surface of the layered structure, and in the at least one second zone the first major surface remains electrically non-conductive.

Flexible electrically conductive bonding films

Adhesive tape for bonding that can be detached without leaving residue and without damaging the surface of a substrate when stretched in a direction of a bond plane. An adhesive tape includes an elastomeric backing having opposing first and second surfaces an acrylate pressure sensitive adhesive disposed on at least one of the first and second surfaces of the backing. The backing includes a copolymer selected from the group consisting of polyether-polyester, polyether-polyamide, and a combination thereof and from about 20 to 60 wt % of a tackifier, based on the total weight of the backing. The backing has an elongation at break greater than 500%.

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Woodbury, MN, United States of America

Roger A Grisle