Intel Corporation

Rodrick J Hendricks

Sujit Sharan

Dae-Woo Kim

Ajay Jain

Neha M Patel

An integrated circuit package is disclosed. The integrated circuit package comprises a first integrated circuit die and a second integrated circuit die. The integrated circuit package further includes a substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the substrate. The substrate includes an interconnect bridge embedded within the substrate, wherein the interconnect bridge includes at least one metal trace component, wherein the metal trace component includes rounded corners on a bottom portion of the metal trace component.

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Rio Rancho, NM, United States of America

Rodrick J Hendricks