Triquint Semiconductor Corporation

Qorvo Us, Inc.

Rodolfo E Chang

George Grama

Suzanne Combe

Tarak A Railkar

Ian Y Yee

Jeffrey D Galipeau

Jason Wu

The present disclosure relates to a high-power acoustic device with improved performance. The disclosed acoustic device includes a substrate, a die-attach material, and an acoustic die. The substrate includes a substrate body and a die pad on a top surface of the substrate body. The die-attach material is a sintered material and applied over the die pad. The acoustic die is coupled to the die pad via the die-attach material. Herein, the acoustic die includes a die body and a metallization structure, which is sandwiched between the die body and the die-attach material.

High-power acoustic device with improved performance

A SAW filter is fabricated with input and output transducers on a piezoelectric substrate and an epoxy based photo-definable acoustic absorber on the substrate for suppressing unwanted acoustic waves. The photo-definable acoustic absorber has a viscosity in a range from about 50 centistokes to 12000 centistokes and a thickness from about 10 microns to 120 microns. One acoustic absorber includes an SU-8 family member epoxy.

Acoustic wave filter manufacturing method using photo-definable epoxy for suppression of unwanted acoustic energy

A SAW filter comprising an input transducer and an output transducer fabricated on a piezoelectric substrate and an epoxy based photo-definable acoustic absorber on the substrate for suppressing unwanted acoustic waves. The photo-definable acoustic absorber has a viscosity in a range from about 50 centistokes to 12000 centistokes and a thickness from about 10 microns to 120 microns. One acoustic absorber includes an SU-8 family member epoxy.

Acoustic wave filters using photo-definable epoxy for suppression of unwanted acoustic energy

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Longwood, FL, United States of America

Rodolfo E Chang