Headway Technologies, Incorporated

International Business Machines Corporation

Rodney E Lee

Cherng-Chyi Han

Mao-Min Chen

Ching Hwa Tsang

Li-Yan Zhu

Kochan Ju

Hugo Alberto Santini

Hung-Liang Hu

Chyu-Jiuh Torng

Hui-Chuan Wang

Jei-Wei Chang

Pokang Wang

Robert E Jones, Jr

Tsu-Hsing Yeh

Jen-Wei C Koo

Yongchang Feng

A method for forming small, isolated device structures by photolithography, utilizing overlapping bi-layer suspension-bridge shaped photomasks. The use of a suspended mask to define a device shape beneath it eliminates the problems associated with uneven undercutting of the usual bi-layer mask which is a stencil portion formed on a lower pedestal. In particular, the use of a suspended mask eliminates undesirable dielectric buildup around the device caused by an insufficiently undercut pedestal or of premature mask lift-off caused by an overly undercut pedestal.

Method to make small isolated features with pseudo-planarization for TMR and MRAM applications

A method for forming a bi-layer lift-off mask for use in fabricating an abutted junction type GMR read-head sensor with a narrow trackwidth of less than 0.5 microns. The mask has a novel suspension bridge structure that avoids problems associated with bilayer lift-off masks of the prior art, namely insufficient or excessive undercutting of the lower layer that produces fence formations in the conducting lead layer or collapse of the mask structure rendering removal difficult.

Bi-layer lift-off process for high track density GMR head

A structure for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In an embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a &ldquo;hot spot&rdquo; area is created where arcing is more likely to occur.

MR lead structure for controlling arcing across thin dielectric film

Methods and structures are disclosed which avoid electrostatic charge build up and subsequent electrostatic discharge (ESD) during the wafer fabrication process of magnetoresistive (MR) or giant magnetoresistive (GMR) read/write heads of magnetic disk drives. This is achieved by designing the wafer layout and process so that the MR/GMR sensor film is shorted to the magnetic shields of the head through shorting paths so that there is an equal potential between MR/GMR sensor film and magnetic shields during the entire fabrication process.

Method to prevent electrostatic discharge for MR/GMR wafer fabrication

A method and design for the fabrication of a laminated yoke for a high data rate magnetic read-write transducer head. A full film layer of first ferromagnetic material is formed on a base using either plating or sputtering. The base comprises a read head, a ferromagnetic pole piece, and a ferromagnetic shield which also serves as a pole piece. A patterned layer of first non-magnetic dielectric is then formed on the full film layer of first ferromagnetic material. A patterned layer of photoresist is then formed on the full film layer of first ferromagnetic material and the patterned non-magnetic dielectric and used as a frame for a frame plating deposition of a patterned layer of second ferromagnetic material. The full film layer of first ferromagnetic material and the non-magnetic dielectric are then patterned, using the patterned layer of second ferromagnetic material as a mask and ion beam etching.

Method to make laminated yoke for high data rate giant magneto-resistive head

A method for preventing and controlling Arcing Across Thin Dielectric Film in sputtering and other process that generate electric fields and cause arcing across conductive structures. In a first embodiment, when the wafer is subjected to RF electric fields from a RF generating tool, the leads are oriented in a first direction which is perpendicular to the RF fields (in a second direction) generated by a RF generating tool (e.g., sputter tool). In a second embodiment, leads are shaped so that the leads extend on both sides of the ABS line so that the MR window,is close to the geometric center of the leads. In a third embodiment, an extraneous window or two extraneous windows are formed in a second dielectric layer under at least of a portion of a lead to that a &ldquo;hot spot&rdquo; area is created where arcing is more likely to occur.

Method for controlling arcing across thin dielectric film

A combined sunken magnetoresistive (MR) read/write head is provided wherein first and second shield layers are eliminated or thinned down in an insulation stack region just behind a pole tip region. This provides a depression behind the pole tip region where head components, such as the write coil, insulation stack and pole pieces of a write head, are located. Leads for an MR sensor of the head extend parallel to an air bearing surface (ABS) where they connect to first and second conductors beyond the limits of the shield layers. The conductors extend back into the head normal to the air bearing surface without any danger of shorting to the shield layers.

Method of making read/write magnetoresistive (MR) head with sunken

Disclosed are methods of allowing the current direction through the sensor or coil of a magneto resistive (MR) read/inductive write head to be consistent with the orienting magnetic field of the sensor or coil by allowing the current direction to be switched by a single mask layer change. This goal is achieved by creating additional connection sites to the non-magnetic mask layer to provide alternative means of connecting element leads to bonding pads and thus providing a choice in which direction to route the current through the sensor or coil of the read/write head.

Optimal wiring configuration for magnetic recording elements

Combined magnetoresistive (MR) read and inductive write head with sunken

Within a method for forming a magnetic transducer head there is first provided a substrate having formed thereover a lower magnetic pole layer in turn having formed thereupon a gap filling layer which is substantially planar. There is then formed upon the gap filling layer a patterned upper magnetic pole tip layer which serves as an etch mask layer for forming from the gap filling layer and the lower magnetic pole layer a patterned gap filling layer and an etched lower magnetic pole layer having a lower magnetic pole tip integral thereto, while simultaneously forming an etched patterned upper magnetic pole tip layer from the patterned upper magnetic pole tip layer. There is then formed upon the etched patterned upper magnetic pole tip layer and the etched lower magnetic pole layer a backfilling insulator layer to a thickness greater than a thickness of the etched patterned upper magnetic pole tip layer plus a thickness of the patterned gap filling layer plus a thickness of the lower magnetic pole tip. There is then planarized the backfilling insulator layer to form a patterned planarized backfilling insulator layer an exposed upper surface of which is coplanar with an exposed upper surface of the etched patterned upper magnetic pole tip layer. Finally, there is then formed a patterned upper magnetic pole layer contacting the exposed upper surface of the etched patterned upper magnetic pole tip layer.

Planarizing method for fabricating an inductive magnetic write head for

A method for fabricating a thin film magnetic head assembly including the procedure of hardening a portion of the upper pole-tip photoresist mask to create a planarizing stitching pedestal in the region where the upper pole-tip overlaps with the upper pole-yoke. The upper pole assembly is deposited in two steps to create a stitched pole consisting of an upper pole-tip joined to an upper pole-yoke element at the stitching pedestal. The method reduces process complexity by eliminating masking steps and also eliminates the usual close alignment requirements for upper insulation and pole-yoke deposition procedures, thereby improving process yield.

Thin film planarization process for fabricating magnetic heads employing

A thin film magnetic transducer having a magnetic circuit having nickel-iron layers which encloses a portion of first and second windings. The portions of each winding traversing the nickel-iron layers have conductor segments equal in number and separated from each other in parallel planes. The conductor segments of each winding have a center-to-center spacing different from the remaining winding selected to avoid contact with the transition regions of the nickel-iron layers and which results in a common inductance for each winding. The windings are joined at one end to form a center tapped winding.

Growing community of inventors

San Jose, CA, United States of America

Rodney E Lee